JPS5655559A - Partial solder plating method to copper tape - Google Patents

Partial solder plating method to copper tape

Info

Publication number
JPS5655559A
JPS5655559A JP12914779A JP12914779A JPS5655559A JP S5655559 A JPS5655559 A JP S5655559A JP 12914779 A JP12914779 A JP 12914779A JP 12914779 A JP12914779 A JP 12914779A JP S5655559 A JPS5655559 A JP S5655559A
Authority
JP
Japan
Prior art keywords
copper tape
rolls
solder
roll
solder plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12914779A
Other languages
Japanese (ja)
Other versions
JPS6353263B2 (en
Inventor
Hajime Abe
Katsumi Nakada
Toyohiko Kumakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP12914779A priority Critical patent/JPS5655559A/en
Publication of JPS5655559A publication Critical patent/JPS5655559A/en
Publication of JPS6353263B2 publication Critical patent/JPS6353263B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To form solder plating of uniform thickness on a copper tape surface by passing the copper tape having been coated with solder flux between heated rolls and supplying a solder material to the predetermined part of the rolls. CONSTITUTION:A copper tape 1 having been coated with soldering flux on the part to be soldered is passed between upper and lower rolls 3, 4. The roll 3 is heated to 280-300 deg.C and the roll 4 to 500 deg.C, respectively by means of burners 5. At the same time, a solder wire 2 is supplied to the roll 3 which corresponds to the part coated with soldering flux and is allowed to contact and stick thereon. The copper tape 1 having passed between the rolls 3, 4 and stuck with the solder is taken up on a take-up machine 7 under predetermined tension while being given upgrade by way of a guide roll 6 provided about 30mm. above the portion between the rolls 3, 4. The soldered copper tape having stable in uniform thickness of solder plating is obtained.
JP12914779A 1979-10-05 1979-10-05 Partial solder plating method to copper tape Granted JPS5655559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12914779A JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12914779A JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Publications (2)

Publication Number Publication Date
JPS5655559A true JPS5655559A (en) 1981-05-16
JPS6353263B2 JPS6353263B2 (en) 1988-10-21

Family

ID=15002287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12914779A Granted JPS5655559A (en) 1979-10-05 1979-10-05 Partial solder plating method to copper tape

Country Status (1)

Country Link
JP (1) JPS5655559A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105886989A (en) * 2016-06-03 2016-08-24 苏州宇邦新型材料股份有限公司 Device for preparing solder strip and method for preparing solder strip through device for preparing solder strip
PL444253A1 (en) * 2023-03-29 2024-09-30 Sieć Badawcza Łukasiewicz - Instytut Metali Nieżelaznych Method of producing soldering layer materials based on copper and silver alloy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105886989A (en) * 2016-06-03 2016-08-24 苏州宇邦新型材料股份有限公司 Device for preparing solder strip and method for preparing solder strip through device for preparing solder strip
PL444253A1 (en) * 2023-03-29 2024-09-30 Sieć Badawcza Łukasiewicz - Instytut Metali Nieżelaznych Method of producing soldering layer materials based on copper and silver alloy

Also Published As

Publication number Publication date
JPS6353263B2 (en) 1988-10-21

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