JPS56112471A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPS56112471A JPS56112471A JP1430980A JP1430980A JPS56112471A JP S56112471 A JPS56112471 A JP S56112471A JP 1430980 A JP1430980 A JP 1430980A JP 1430980 A JP1430980 A JP 1430980A JP S56112471 A JPS56112471 A JP S56112471A
- Authority
- JP
- Japan
- Prior art keywords
- led
- substrate
- target
- sputtering
- opposing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Thin Magnetic Films (AREA)
Abstract
PURPOSE:To obtain a sputtering device which forms a thin film of metal continuously and uniformly on the film substrate without causing curling and deforming, by consituting so as to lower the temp. of a film substrate by means of cooling elements provided between the plural sputtering regions of a film substrate conveying path. CONSTITUTION:In a vacuum vessel 1, a film substrate 8 is rewound from a supply reel 9, is guided by a tape guide 10a and is led to the target opposing surface of a substrate holde 6a. After said 8 has run on this opposing surface, it is led to metal- made rotator 11a-11c parts which are cooling elements, by a tape guide 10b, and further it is led to the target opposing surface of a substrate holder 6b by a tape guide 10c, after which it is taken up by a take-up reel 12. During this time, a thin film of sputtering is formed in the 1st region by a target 4a on the substrate 8 led by the reel 9, after which the heat evolved is removed by said rorators. Thence, it is led to the 2nd region to form a thin film of sputtering by a target 4b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430980A JPS56112471A (en) | 1980-02-08 | 1980-02-08 | Sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1430980A JPS56112471A (en) | 1980-02-08 | 1980-02-08 | Sputtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56112471A true JPS56112471A (en) | 1981-09-04 |
Family
ID=11857490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1430980A Pending JPS56112471A (en) | 1980-02-08 | 1980-02-08 | Sputtering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56112471A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57179952A (en) * | 1981-04-24 | 1982-11-05 | Fuji Photo Film Co Ltd | Method and apparatus for magnetic recording medium |
| EP0082001A1 (en) * | 1981-12-16 | 1983-06-22 | General Engineering Radcliffe 1979 Limited | Apparatus for and a method of metallising a length of material |
| JPS58136777A (en) * | 1982-02-09 | 1983-08-13 | Hitachi Ltd | Thin film forming device by sputtering |
| JPS5921662U (en) * | 1982-07-30 | 1984-02-09 | 株式会社徳田製作所 | sputtering equipment |
| JPS59162274A (en) * | 1983-03-07 | 1984-09-13 | Anelva Corp | Continuous producing device for thin film |
| JPS6320483A (en) * | 1986-07-15 | 1988-01-28 | Canon Inc | Fine particle spraying device |
| EP0672762A1 (en) * | 1994-03-18 | 1995-09-20 | GALILEO VACUUM TEC S.p.A. | Apparatus for continuous vacuum metallization |
| EP4249841A3 (en) * | 2019-03-20 | 2023-11-29 | Fujitsu General Limited | Heat exchanger |
-
1980
- 1980-02-08 JP JP1430980A patent/JPS56112471A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57179952A (en) * | 1981-04-24 | 1982-11-05 | Fuji Photo Film Co Ltd | Method and apparatus for magnetic recording medium |
| JPH0435810B2 (en) * | 1981-04-24 | 1992-06-12 | Fuji Photo Film Co Ltd | |
| EP0082001A1 (en) * | 1981-12-16 | 1983-06-22 | General Engineering Radcliffe 1979 Limited | Apparatus for and a method of metallising a length of material |
| JPS58136777A (en) * | 1982-02-09 | 1983-08-13 | Hitachi Ltd | Thin film forming device by sputtering |
| JPS6160908B2 (en) * | 1982-02-09 | 1986-12-23 | Hitachi Ltd | |
| JPS5921662U (en) * | 1982-07-30 | 1984-02-09 | 株式会社徳田製作所 | sputtering equipment |
| JPS5935580Y2 (en) * | 1982-07-30 | 1984-10-01 | 株式会社徳田製作所 | sputtering equipment |
| JPS59162274A (en) * | 1983-03-07 | 1984-09-13 | Anelva Corp | Continuous producing device for thin film |
| JPS6320483A (en) * | 1986-07-15 | 1988-01-28 | Canon Inc | Fine particle spraying device |
| EP0672762A1 (en) * | 1994-03-18 | 1995-09-20 | GALILEO VACUUM TEC S.p.A. | Apparatus for continuous vacuum metallization |
| EP4249841A3 (en) * | 2019-03-20 | 2023-11-29 | Fujitsu General Limited | Heat exchanger |
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