JPS6453419A - Resist coating device - Google Patents

Resist coating device

Info

Publication number
JPS6453419A
JPS6453419A JP21091787A JP21091787A JPS6453419A JP S6453419 A JPS6453419 A JP S6453419A JP 21091787 A JP21091787 A JP 21091787A JP 21091787 A JP21091787 A JP 21091787A JP S6453419 A JPS6453419 A JP S6453419A
Authority
JP
Japan
Prior art keywords
resist
coating device
wafer
rising
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21091787A
Other languages
Japanese (ja)
Inventor
Akihiko Shiguma
Yoshiyuki Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21091787A priority Critical patent/JPS6453419A/en
Publication of JPS6453419A publication Critical patent/JPS6453419A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To form a uniform resist thin film on the surface of a wafer by a method wherein temperature of the atmosphere in the dust cover of a resist coating device is restrained from rising CONSTITUTION:Cooling gas controlled at specified low temperature is fed from a gas supply source 18 through a duct 17 provided on a dust cover 7 so that the atmosphere in the duct cover 7 may be agitated to restrain the atmospheric temperature from rising by heating a chuck 2. Through these procedures, uneven drying of resist solution R coated on the surface of a wafer 1 can be prevented from occurring enabling an even resist thin film to be formed.
JP21091787A 1987-08-24 1987-08-24 Resist coating device Pending JPS6453419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21091787A JPS6453419A (en) 1987-08-24 1987-08-24 Resist coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21091787A JPS6453419A (en) 1987-08-24 1987-08-24 Resist coating device

Publications (1)

Publication Number Publication Date
JPS6453419A true JPS6453419A (en) 1989-03-01

Family

ID=16597204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21091787A Pending JPS6453419A (en) 1987-08-24 1987-08-24 Resist coating device

Country Status (1)

Country Link
JP (1) JPS6453419A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02307568A (en) * 1989-05-22 1990-12-20 Nec Corp Method and apparatus for coating application
JP2009062938A (en) * 2007-09-07 2009-03-26 Honda Motor Co Ltd Cooling water passage structure of engine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02307568A (en) * 1989-05-22 1990-12-20 Nec Corp Method and apparatus for coating application
JP2009062938A (en) * 2007-09-07 2009-03-26 Honda Motor Co Ltd Cooling water passage structure of engine

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