JPS5771666A - Apparatus for coating resist - Google Patents

Apparatus for coating resist

Info

Publication number
JPS5771666A
JPS5771666A JP14650580A JP14650580A JPS5771666A JP S5771666 A JPS5771666 A JP S5771666A JP 14650580 A JP14650580 A JP 14650580A JP 14650580 A JP14650580 A JP 14650580A JP S5771666 A JPS5771666 A JP S5771666A
Authority
JP
Japan
Prior art keywords
wafer
resist
gas
plate
substrate plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14650580A
Other languages
Japanese (ja)
Inventor
Ryosuke Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP14650580A priority Critical patent/JPS5771666A/en
Publication of JPS5771666A publication Critical patent/JPS5771666A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To form a uniform film free from an adhered substance by injecting a gas from an upper part above a substrare plate which has to be coated with a resist to such a direction that said gas is not directly hit to a resist coated subtrate plate.
CONSTITUTION: A wafer substrate plate 11 is set on a wafer chuck 10 and, after a resist material is dropped on the wafer substrate plate 11, said wafer substrate plate 11 is rotated along with the wafer chuck to from a uniform resist film. During a time when the wafer is rotated, an N2 gas or air is flowed from a gas injecting port 12 above the wafer and said gas is adjusted so as not to be directly hit to a surface of the wafer. That is, because a stream of said gas toward a side direction or a lower direction of the wafer from an upper part above the wafer substrate plate 11 is formed, the mist like resist generated during resist coating is not blown up onto the wafer substrare plate 11 and exhausted to a side direction or a lower direction and is not readhered on a resist film.
COPYRIGHT: (C)1982,JPO&Japio
JP14650580A 1980-10-20 1980-10-20 Apparatus for coating resist Pending JPS5771666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14650580A JPS5771666A (en) 1980-10-20 1980-10-20 Apparatus for coating resist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14650580A JPS5771666A (en) 1980-10-20 1980-10-20 Apparatus for coating resist

Publications (1)

Publication Number Publication Date
JPS5771666A true JPS5771666A (en) 1982-05-04

Family

ID=15409141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14650580A Pending JPS5771666A (en) 1980-10-20 1980-10-20 Apparatus for coating resist

Country Status (1)

Country Link
JP (1) JPS5771666A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63188940U (en) * 1987-05-28 1988-12-05

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337582U (en) * 1976-09-06 1978-04-01
JPS55165170A (en) * 1979-06-07 1980-12-23 Mitsubishi Electric Corp Application apparatus of resist agent

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337582U (en) * 1976-09-06 1978-04-01
JPS55165170A (en) * 1979-06-07 1980-12-23 Mitsubishi Electric Corp Application apparatus of resist agent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63188940U (en) * 1987-05-28 1988-12-05
JPH0521864Y2 (en) * 1987-05-28 1993-06-04

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