JPS56100455A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56100455A
JPS56100455A JP258680A JP258680A JPS56100455A JP S56100455 A JPS56100455 A JP S56100455A JP 258680 A JP258680 A JP 258680A JP 258680 A JP258680 A JP 258680A JP S56100455 A JPS56100455 A JP S56100455A
Authority
JP
Japan
Prior art keywords
leads
frame
turned
sealed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP258680A
Other languages
Japanese (ja)
Other versions
JPS6050337B2 (en
Inventor
Michitoshi Sera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP258680A priority Critical patent/JPS6050337B2/en
Publication of JPS56100455A publication Critical patent/JPS56100455A/en
Publication of JPS6050337B2 publication Critical patent/JPS6050337B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve productivity and the quality of soldering by a method wherein the device already sealed with resin with supporting leads being left is supported and turned at 90 deg. so as for the lead on one side to be soldered and then turned reversely at 180 deg. for the other side to be soldered. CONSTITUTION:The semiconductor device 8 sealed with resin is supported by a frame through the leads 5a and 5b. The sealed body 8' is turned at an angle of 90 deg. on the leads 5a and 5b as axes. Then leads 3a... on one side of the device are positioned on the underside to the surface of a frame and immersed in melted solder 10. Next, the body is twisted at 180 deg. around the center line of the frame in the longitudinal direction thereof and thereby leads 3b... are positioned on the underside to be immersed in the melted solder in the same way. By this constitution, the process can be automated and the efficiency of production is raised, while the thickness of solder, wet length, brilliance, etc. can be uniformalized.
JP258680A 1980-01-16 1980-01-16 Manufacturing method of semiconductor device Expired JPS6050337B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP258680A JPS6050337B2 (en) 1980-01-16 1980-01-16 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP258680A JPS6050337B2 (en) 1980-01-16 1980-01-16 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56100455A true JPS56100455A (en) 1981-08-12
JPS6050337B2 JPS6050337B2 (en) 1985-11-08

Family

ID=11533472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP258680A Expired JPS6050337B2 (en) 1980-01-16 1980-01-16 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6050337B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059761A (en) * 1983-09-12 1985-04-06 Mitsubishi Electric Corp Preliminarily soldering device
JPH0373561A (en) * 1989-08-14 1991-03-28 Fujitsu Ltd Lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059761A (en) * 1983-09-12 1985-04-06 Mitsubishi Electric Corp Preliminarily soldering device
JPH0373561A (en) * 1989-08-14 1991-03-28 Fujitsu Ltd Lead frame

Also Published As

Publication number Publication date
JPS6050337B2 (en) 1985-11-08

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