JPS568845A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS568845A
JPS568845A JP8568679A JP8568679A JPS568845A JP S568845 A JPS568845 A JP S568845A JP 8568679 A JP8568679 A JP 8568679A JP 8568679 A JP8568679 A JP 8568679A JP S568845 A JPS568845 A JP S568845A
Authority
JP
Japan
Prior art keywords
solder material
wafer
pellets
semiconductor
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8568679A
Other languages
Japanese (ja)
Other versions
JPS609661B2 (en
Inventor
Kazuhisa Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP54085686A priority Critical patent/JPS609661B2/en
Publication of JPS568845A publication Critical patent/JPS568845A/en
Publication of JPS609661B2 publication Critical patent/JPS609661B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To elevate the productivity of a semiconductor device and to prevent the deterioration of character by a method wherein an electrode material is fitted up to a semiconductor wafer putting a solder material between them and semiconductor pellets are extracted from the semiconductor wafer. CONSTITUTION:Plural electrode metals 4 formed in the shape of circular column are prepared at the under face of semiconductor wafer 1 having a p-n junction putting a solder material between them and are assembled, and the solder material 5 is made to molten to weld the wafer 1 and the metal 4. By punching out pellets 2a from the wafer 1, pellets 2 and the metals 4 are separated from the water 1 and can be taken out in the condition being soldered with the solder material 5. As a result, the manufacturing process is shortened and the reduction of manufacturing yield caused by the cracking of pellet during the process can be got rid of.
JP54085686A 1979-07-03 1979-07-03 Manufacturing method of semiconductor device Expired JPS609661B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54085686A JPS609661B2 (en) 1979-07-03 1979-07-03 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54085686A JPS609661B2 (en) 1979-07-03 1979-07-03 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS568845A true JPS568845A (en) 1981-01-29
JPS609661B2 JPS609661B2 (en) 1985-03-12

Family

ID=13865723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54085686A Expired JPS609661B2 (en) 1979-07-03 1979-07-03 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS609661B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969151A (en) * 1982-10-13 1984-04-19 Unitika Ltd Spherical ion exchange resin and its production and adsorptive treatment
JPS6210126A (en) * 1985-07-05 1987-01-19 Unitika Ltd Microspherical cured melamine resin particle and its production

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152460U (en) * 1985-03-13 1986-09-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969151A (en) * 1982-10-13 1984-04-19 Unitika Ltd Spherical ion exchange resin and its production and adsorptive treatment
JPH0356783B2 (en) * 1982-10-13 1991-08-29
JPS6210126A (en) * 1985-07-05 1987-01-19 Unitika Ltd Microspherical cured melamine resin particle and its production

Also Published As

Publication number Publication date
JPS609661B2 (en) 1985-03-12

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