JPS54133071A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54133071A
JPS54133071A JP4098778A JP4098778A JPS54133071A JP S54133071 A JPS54133071 A JP S54133071A JP 4098778 A JP4098778 A JP 4098778A JP 4098778 A JP4098778 A JP 4098778A JP S54133071 A JPS54133071 A JP S54133071A
Authority
JP
Japan
Prior art keywords
substrate
split
solder
manufacture
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4098778A
Other languages
Japanese (ja)
Inventor
Shinichi Akashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4098778A priority Critical patent/JPS54133071A/en
Publication of JPS54133071A publication Critical patent/JPS54133071A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To enable no wafer crack in solder welding, no working efficiency decrease in split process and to make excellent the solderability.
CONSTITUTION: At the back of the Si substrate 10, the alloy layer 4 with Ni is provided, and the layer 4 for split part is eliminated in advance. Next, the substrate 10 is dipped in the molten solder vessel and the solder 5 is selectively welded on the alloy layer. The thermal stress in case is split to each element and it is very small as the entire substrate, then the substrate is not cracked and split can completely be made because of no solder between elements.
COPYRIGHT: (C)1979,JPO&Japio
JP4098778A 1978-04-06 1978-04-06 Manufacture for semiconductor device Pending JPS54133071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4098778A JPS54133071A (en) 1978-04-06 1978-04-06 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4098778A JPS54133071A (en) 1978-04-06 1978-04-06 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54133071A true JPS54133071A (en) 1979-10-16

Family

ID=12595770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4098778A Pending JPS54133071A (en) 1978-04-06 1978-04-06 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54133071A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864037A (en) * 1981-10-13 1983-04-16 Nec Home Electronics Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864037A (en) * 1981-10-13 1983-04-16 Nec Home Electronics Ltd Manufacture of semiconductor device

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