JPS53108764A - Diffusion jig of semiconductor wafers - Google Patents

Diffusion jig of semiconductor wafers

Info

Publication number
JPS53108764A
JPS53108764A JP2360477A JP2360477A JPS53108764A JP S53108764 A JPS53108764 A JP S53108764A JP 2360477 A JP2360477 A JP 2360477A JP 2360477 A JP2360477 A JP 2360477A JP S53108764 A JPS53108764 A JP S53108764A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
jig
wafers
diffusion jig
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2360477A
Other languages
Japanese (ja)
Inventor
Shunji Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2360477A priority Critical patent/JPS53108764A/en
Publication of JPS53108764A publication Critical patent/JPS53108764A/en
Pending legal-status Critical Current

Links

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  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE: To reduce the heat capacity of a jig and reduce the change in crystals owing to temperature difference within wafers by forming the diffusion jig for placement of semiconductor wafers by hollow bar-form heat-resistant and corrosion-resistant materials provided with grooves for supporting wafers.
COPYRIGHT: (C)1978,JPO&Japio
JP2360477A 1977-03-04 1977-03-04 Diffusion jig of semiconductor wafers Pending JPS53108764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2360477A JPS53108764A (en) 1977-03-04 1977-03-04 Diffusion jig of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2360477A JPS53108764A (en) 1977-03-04 1977-03-04 Diffusion jig of semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS53108764A true JPS53108764A (en) 1978-09-21

Family

ID=12115198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2360477A Pending JPS53108764A (en) 1977-03-04 1977-03-04 Diffusion jig of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS53108764A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6398123A (en) * 1986-10-15 1988-04-28 Tokai Kounetsu Kogyo Kk Manufacture of wafer boat for manufacturing semiconductor
JPH01259528A (en) * 1988-04-08 1989-10-17 Hitachi Ltd Wafer supporting device for semiconductor wafer heat-treating apparatus, and semiconductor wafer heat-treating apparatus
JPH04192517A (en) * 1990-11-27 1992-07-10 Nec Yamagata Ltd Semiconductor manufacturing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6398123A (en) * 1986-10-15 1988-04-28 Tokai Kounetsu Kogyo Kk Manufacture of wafer boat for manufacturing semiconductor
JPH0770494B2 (en) * 1986-10-15 1995-07-31 東海高熱工業株式会社 Wafer boat manufacturing method for semiconductor manufacturing
JPH01259528A (en) * 1988-04-08 1989-10-17 Hitachi Ltd Wafer supporting device for semiconductor wafer heat-treating apparatus, and semiconductor wafer heat-treating apparatus
JPH04192517A (en) * 1990-11-27 1992-07-10 Nec Yamagata Ltd Semiconductor manufacturing apparatus

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