JPS52142972A - Semiconductor production device - Google Patents
Semiconductor production deviceInfo
- Publication number
- JPS52142972A JPS52142972A JP6037376A JP6037376A JPS52142972A JP S52142972 A JPS52142972 A JP S52142972A JP 6037376 A JP6037376 A JP 6037376A JP 6037376 A JP6037376 A JP 6037376A JP S52142972 A JPS52142972 A JP S52142972A
- Authority
- JP
- Japan
- Prior art keywords
- production device
- semiconductor production
- wafers
- eliminating
- fire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
PURPOSE: To fire wafers at high accuracy and efficiency by eliminating the defects of hot plate system in temperature controlling of the wafers themselves or their handling.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6037376A JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6037376A JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52142972A true JPS52142972A (en) | 1977-11-29 |
JPS6113373B2 JPS6113373B2 (en) | 1986-04-12 |
Family
ID=13140255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6037376A Granted JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52142972A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5522125U (en) * | 1978-07-31 | 1980-02-13 | ||
JPS58176936A (en) * | 1982-04-09 | 1983-10-17 | Fujitsu Ltd | Substrate cooling method |
JPS59175122A (en) * | 1983-03-23 | 1984-10-03 | Nec Corp | Before-coating processing device for semiconductor wafer |
JPS59211243A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Semiconductor substrate treating device |
JPS625635U (en) * | 1985-06-26 | 1987-01-14 |
-
1976
- 1976-05-25 JP JP6037376A patent/JPS52142972A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5522125U (en) * | 1978-07-31 | 1980-02-13 | ||
JPS58176936A (en) * | 1982-04-09 | 1983-10-17 | Fujitsu Ltd | Substrate cooling method |
JPH0313734B2 (en) * | 1982-04-09 | 1991-02-25 | Fujitsu Ltd | |
JPS59175122A (en) * | 1983-03-23 | 1984-10-03 | Nec Corp | Before-coating processing device for semiconductor wafer |
JPS6355860B2 (en) * | 1983-03-23 | 1988-11-04 | Nippon Electric Co | |
JPS59211243A (en) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | Semiconductor substrate treating device |
JPS625635U (en) * | 1985-06-26 | 1987-01-14 | ||
JPH0234822Y2 (en) * | 1985-06-26 | 1990-09-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS6113373B2 (en) | 1986-04-12 |
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