JPS52142972A - Semiconductor production device - Google Patents

Semiconductor production device

Info

Publication number
JPS52142972A
JPS52142972A JP6037376A JP6037376A JPS52142972A JP S52142972 A JPS52142972 A JP S52142972A JP 6037376 A JP6037376 A JP 6037376A JP 6037376 A JP6037376 A JP 6037376A JP S52142972 A JPS52142972 A JP S52142972A
Authority
JP
Japan
Prior art keywords
production device
semiconductor production
wafers
eliminating
fire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6037376A
Other languages
Japanese (ja)
Other versions
JPS6113373B2 (en
Inventor
Okimitsu Yasuda
Takahiro Torii
Kazuo Numajiri
Toshiharu Kai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6037376A priority Critical patent/JPS52142972A/en
Publication of JPS52142972A publication Critical patent/JPS52142972A/en
Publication of JPS6113373B2 publication Critical patent/JPS6113373B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE: To fire wafers at high accuracy and efficiency by eliminating the defects of hot plate system in temperature controlling of the wafers themselves or their handling.
COPYRIGHT: (C)1977,JPO&Japio
JP6037376A 1976-05-25 1976-05-25 Semiconductor production device Granted JPS52142972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6037376A JPS52142972A (en) 1976-05-25 1976-05-25 Semiconductor production device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6037376A JPS52142972A (en) 1976-05-25 1976-05-25 Semiconductor production device

Publications (2)

Publication Number Publication Date
JPS52142972A true JPS52142972A (en) 1977-11-29
JPS6113373B2 JPS6113373B2 (en) 1986-04-12

Family

ID=13140255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6037376A Granted JPS52142972A (en) 1976-05-25 1976-05-25 Semiconductor production device

Country Status (1)

Country Link
JP (1) JPS52142972A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522125U (en) * 1978-07-31 1980-02-13
JPS58176936A (en) * 1982-04-09 1983-10-17 Fujitsu Ltd Substrate cooling method
JPS59175122A (en) * 1983-03-23 1984-10-03 Nec Corp Before-coating processing device for semiconductor wafer
JPS59211243A (en) * 1983-05-17 1984-11-30 Toshiba Corp Semiconductor substrate treating device
JPS625635U (en) * 1985-06-26 1987-01-14

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522125U (en) * 1978-07-31 1980-02-13
JPS58176936A (en) * 1982-04-09 1983-10-17 Fujitsu Ltd Substrate cooling method
JPH0313734B2 (en) * 1982-04-09 1991-02-25 Fujitsu Ltd
JPS59175122A (en) * 1983-03-23 1984-10-03 Nec Corp Before-coating processing device for semiconductor wafer
JPS6355860B2 (en) * 1983-03-23 1988-11-04 Nippon Electric Co
JPS59211243A (en) * 1983-05-17 1984-11-30 Toshiba Corp Semiconductor substrate treating device
JPS625635U (en) * 1985-06-26 1987-01-14
JPH0234822Y2 (en) * 1985-06-26 1990-09-19

Also Published As

Publication number Publication date
JPS6113373B2 (en) 1986-04-12

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