JPS57194557A - Package with radiating fin - Google Patents

Package with radiating fin

Info

Publication number
JPS57194557A
JPS57194557A JP7956681A JP7956681A JPS57194557A JP S57194557 A JPS57194557 A JP S57194557A JP 7956681 A JP7956681 A JP 7956681A JP 7956681 A JP7956681 A JP 7956681A JP S57194557 A JPS57194557 A JP S57194557A
Authority
JP
Japan
Prior art keywords
fixed
substrate
radiating fins
semiconductor elements
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7956681A
Other languages
Japanese (ja)
Inventor
Tamio Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7956681A priority Critical patent/JPS57194557A/en
Publication of JPS57194557A publication Critical patent/JPS57194557A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To facilitate the replacement of elements by a method wherein the metallic radiating fins are fixed to the backside of substrate whereon the semiconductor elements are mounted by means of silver soldering with the melting point exceeding 300 deg.C. CONSTITUTION:The cap 2 is fixed to the ceramic substrate 1 by means of soldering to seal the semiconductor elements airtightly while the leads 5 are fixed to the ends of said substrate 1. The multiple radiating fins 3' are fixed to the backside of said substrate 1 by means of silver soldering with the melting point exceeding 300 deg.C. Through these procedures, the radiating fins may be prevented from being taken off in case the cap 2 is removed facilitating the replacement of the semiconductor elements.
JP7956681A 1981-05-26 1981-05-26 Package with radiating fin Pending JPS57194557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7956681A JPS57194557A (en) 1981-05-26 1981-05-26 Package with radiating fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7956681A JPS57194557A (en) 1981-05-26 1981-05-26 Package with radiating fin

Publications (1)

Publication Number Publication Date
JPS57194557A true JPS57194557A (en) 1982-11-30

Family

ID=13693551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7956681A Pending JPS57194557A (en) 1981-05-26 1981-05-26 Package with radiating fin

Country Status (1)

Country Link
JP (1) JPS57194557A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849985B1 (en) 2007-05-23 2008-08-01 에이디반도체(주) Capacitance switch module having sensing electrode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849985B1 (en) 2007-05-23 2008-08-01 에이디반도체(주) Capacitance switch module having sensing electrode

Similar Documents

Publication Publication Date Title
JPS5762539A (en) Mounting method for semiconductor element
JPS57194557A (en) Package with radiating fin
JPS548462A (en) Manufacture for semiconductor
JPS52147064A (en) Semiconductor device
JPS54129976A (en) Ic lead frame
JPS57194556A (en) Heat radiating package
JPS54128277A (en) Semiconductor device
JPS5429555A (en) Heat sink constituent
JPS54152473A (en) Package for semiconductor device
KR820000468Y1 (en) Semiconductor device
JPS5372458A (en) Fixing method for semiconductor substrate
JPS5567146A (en) Method for manufacturing semiconductor device
JPS54102969A (en) Semiconductor device
JPS54133071A (en) Manufacture for semiconductor device
JPS5386158A (en) Production of semiconductor device
JPS5351964A (en) Selective growth method for semiconductor crystal
JPS55148445A (en) Semiconductor device
JPS5368573A (en) Hermetic sealing method of semiconductor device
JPS5498177A (en) Glass seal type semiconductor device
JPS52143767A (en) Production of semiconductor device
JPS54115070A (en) Manufacture for semiconductor element
JPS54149578A (en) Soldering method for ag lead wire
JPS5553429A (en) Ceramic package type semiconductor device
JPS5360172A (en) Production of semiconductor device
JPS52155057A (en) Glass sealed type semiconductor device