JPS54129976A - Ic lead frame - Google Patents
Ic lead frameInfo
- Publication number
- JPS54129976A JPS54129976A JP3771778A JP3771778A JPS54129976A JP S54129976 A JPS54129976 A JP S54129976A JP 3771778 A JP3771778 A JP 3771778A JP 3771778 A JP3771778 A JP 3771778A JP S54129976 A JPS54129976 A JP S54129976A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- layer
- onto
- alloy
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To obtain resistance to a high temperature, to maintain excellent solderability, and to prevent the breakdown of a chip, by providing an Ag layer onto the Sn-Ni alloy layer at an edge part inside of a lead where the fixing part of the IC chip is connected to the chip.
CONSTITUTION: After thermal oxidation, Sn-Ni alloy maintains excellent solderability and also suppresses whisker growth of Sn. For the purpose, a Sn-Ni alloy layer is provided onto the entire metal substrate first and an Ag plating layer is provided partially onto it. As a result, a grown Sn whisker will never penetrate the Ag layer to break the chip of a Si thin plate of insufficient elasticity like a pure-Sn plating layer, so that a lead frame of good quality can be obtained.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3771778A JPS5936426B2 (en) | 1978-03-31 | 1978-03-31 | IC lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3771778A JPS5936426B2 (en) | 1978-03-31 | 1978-03-31 | IC lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54129976A true JPS54129976A (en) | 1979-10-08 |
JPS5936426B2 JPS5936426B2 (en) | 1984-09-04 |
Family
ID=12505258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3771778A Expired JPS5936426B2 (en) | 1978-03-31 | 1978-03-31 | IC lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5936426B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175754A (en) * | 1983-03-26 | 1984-10-04 | Furukawa Electric Co Ltd:The | Lead frame for integrated circuit |
JPS60147145A (en) * | 1984-01-10 | 1985-08-03 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS60225456A (en) * | 1984-04-24 | 1985-11-09 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS6149451A (en) * | 1984-08-17 | 1986-03-11 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS61121746U (en) * | 1985-01-16 | 1986-07-31 | ||
US4707724A (en) * | 1984-06-04 | 1987-11-17 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
JPS63150949A (en) * | 1986-12-12 | 1988-06-23 | Nippon Chem Denshi Kk | Lead frame for semiconductor and manufacture thereof |
US6207298B1 (en) * | 1997-12-25 | 2001-03-27 | Japan Solderless Terminal Mfg. Co., Ltd. | Connector surface-treated with a Sn-Ni alloy |
WO2020235292A1 (en) * | 2019-05-23 | 2020-11-26 | 古河電気工業株式会社 | Lead frame member, manufacturing method thereof, lead frame and electrical or electronic component |
-
1978
- 1978-03-31 JP JP3771778A patent/JPS5936426B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175754A (en) * | 1983-03-26 | 1984-10-04 | Furukawa Electric Co Ltd:The | Lead frame for integrated circuit |
JPS60147145A (en) * | 1984-01-10 | 1985-08-03 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS60225456A (en) * | 1984-04-24 | 1985-11-09 | Hitachi Cable Ltd | Lead frame for semiconductor |
US4707724A (en) * | 1984-06-04 | 1987-11-17 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
JPS6149451A (en) * | 1984-08-17 | 1986-03-11 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS61121746U (en) * | 1985-01-16 | 1986-07-31 | ||
JPS63150949A (en) * | 1986-12-12 | 1988-06-23 | Nippon Chem Denshi Kk | Lead frame for semiconductor and manufacture thereof |
US6207298B1 (en) * | 1997-12-25 | 2001-03-27 | Japan Solderless Terminal Mfg. Co., Ltd. | Connector surface-treated with a Sn-Ni alloy |
WO2020235292A1 (en) * | 2019-05-23 | 2020-11-26 | 古河電気工業株式会社 | Lead frame member, manufacturing method thereof, lead frame and electrical or electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS5936426B2 (en) | 1984-09-04 |
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