JPS61121746U - - Google Patents
Info
- Publication number
- JPS61121746U JPS61121746U JP391585U JP391585U JPS61121746U JP S61121746 U JPS61121746 U JP S61121746U JP 391585 U JP391585 U JP 391585U JP 391585 U JP391585 U JP 391585U JP S61121746 U JPS61121746 U JP S61121746U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wire material
- nickel
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第1図は、本考案の一実施例を示す断面図、第
2図は他の実施例を示す断面図、第3図は本考案
の半導体素子用リード線材を用いたレジンモール
ドダイオードの断面図、第4図は従来用いられて
いるリード線材の断面図、第5図は第4図に示し
たリード線材を用いたガラスモールドダイオード
の断面図である。
1A……半導体素子用リード線材、2……心線
、10……プラスチツク、11……ニツケル―錫
めつき、12……ニツケルめつき。
Fig. 1 is a cross-sectional view showing one embodiment of the present invention, Fig. 2 is a cross-sectional view showing another embodiment, and Fig. 3 is a cross-sectional view of a resin molded diode using the lead wire material for semiconductor elements of the present invention. 4 is a sectional view of a conventionally used lead wire material, and FIG. 5 is a sectional view of a glass mold diode using the lead wire material shown in FIG. 4. 1A... Lead wire material for semiconductor elements, 2... Core wire, 10... Plastic, 11... Nickel-tin plating, 12... Nickel plating.
Claims (1)
ツクとの密着性が優れた皮膜とから成ることを特
徴とする半導体素子用リード線材。 (2) 皮膜がニツケル―錫めつきである実用新案
登録請求の範囲第1項記載の半導体素子用リード
線材。 (3) 皮膜がニツケルめつきおよびこの上のニツ
ケル―錫めつきから成る実用新案登録請求の範囲
第1項記載の半導体素子用リード線材。 (4) ニツケル―錫めつき中の錫の組成が50〜
90%である実用新案登録請求の範囲第2項また
は第3項記載の半導体素子用リード線材。 (5) めつきを電気めつきで行う実用新案登録請
求の範囲第1項ないし第4項のいずれか記載の半
導体素子用リード線材。[Claims for Utility Model Registration] (1) A lead wire material for semiconductor devices, characterized by comprising a core wire and a film plated on the surface of the core wire and having excellent adhesion to plastic. (2) The lead wire material for a semiconductor device according to claim 1 of the utility model registration claim, wherein the coating is nickel-tin plating. (3) The lead wire material for a semiconductor device according to claim 1, wherein the coating is comprised of nickel plating and nickel-tin plating thereon. (4) Nickel - The composition of tin in tin plating is 50~
The lead wire material for semiconductor devices according to claim 2 or 3, which has a utility model registration of 90%. (5) A lead wire material for a semiconductor device according to any one of claims 1 to 4 of the utility model registration claim, in which plating is performed by electroplating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP391585U JPS61121746U (en) | 1985-01-16 | 1985-01-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP391585U JPS61121746U (en) | 1985-01-16 | 1985-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61121746U true JPS61121746U (en) | 1986-07-31 |
Family
ID=30478989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP391585U Pending JPS61121746U (en) | 1985-01-16 | 1985-01-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61121746U (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5366169A (en) * | 1976-11-26 | 1978-06-13 | Hitachi Ltd | Lead frame for resin charging |
JPS54129976A (en) * | 1978-03-31 | 1979-10-08 | Nippon Gakki Seizo Kk | Ic lead frame |
JPS5617048A (en) * | 1979-07-20 | 1981-02-18 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
JPS5858353B2 (en) * | 1975-06-09 | 1983-12-24 | 武田薬品工業株式会社 | Cefem or penam compound and its production method |
-
1985
- 1985-01-16 JP JP391585U patent/JPS61121746U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5858353B2 (en) * | 1975-06-09 | 1983-12-24 | 武田薬品工業株式会社 | Cefem or penam compound and its production method |
JPS5366169A (en) * | 1976-11-26 | 1978-06-13 | Hitachi Ltd | Lead frame for resin charging |
JPS54129976A (en) * | 1978-03-31 | 1979-10-08 | Nippon Gakki Seizo Kk | Ic lead frame |
JPS5617048A (en) * | 1979-07-20 | 1981-02-18 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
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