JPS6370199U - - Google Patents
Info
- Publication number
- JPS6370199U JPS6370199U JP16341786U JP16341786U JPS6370199U JP S6370199 U JPS6370199 U JP S6370199U JP 16341786 U JP16341786 U JP 16341786U JP 16341786 U JP16341786 U JP 16341786U JP S6370199 U JPS6370199 U JP S6370199U
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- exposed
- utility
- model registration
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
Description
第1図は、本考案のシールド成形品の導通部の
一例を示す断面図である。第2図は、本考案のシ
ールド成形品の導通部の別の態様を示す断面図で
ある。
1……シールド成形品の導通部、2……基材、
3……導電層、5……射出成形による樹脂層、6
(6A,6B)……金属製のリード。
FIG. 1 is a sectional view showing an example of a conductive part of a shield molded product of the present invention. FIG. 2 is a sectional view showing another embodiment of the conductive portion of the shield molded product of the present invention. 1... Conductive part of shield molded product, 2... Base material,
3... Conductive layer, 5... Resin layer by injection molding, 6
(6A, 6B)...Metal lead.
Claims (1)
出成形により樹脂層5と一体化してなるシールド
成形品において、金属製のリード6を、その一端
が導電層3に接触し他端が成形品外部に露出する
ように設けることにより導通を確保してなるシー
ルド成形品の導通部1。 (2) 金属製のリード6の他端を樹脂層5を貫い
て成形品外部に露出させた実用新案登録請求の範
囲第1項のシールド成形品の導通部1。 (3) 金属製のリードとして金属テープ6Bを使
用し、その一端を導電層3に貼り合せ他端を成形
品の端部から露出させた実用新案登録請求の範囲
第1項のシールド成形品の導通部1。[Claims for Utility Model Registration] (1) In a shield molded product in which a base material 2 and a conductive layer 3 provided thereon are integrated with a resin layer 5 by injection molding, a metal lead 6 is attached at one end thereof. A conductive portion 1 of a shield molded product that is in contact with a conductive layer 3 and is provided with the other end exposed to the outside of the molded product to ensure continuity. (2) The conductive part 1 of the shield molded product according to claim 1 of the utility model registration claim, in which the other end of the metal lead 6 penetrates the resin layer 5 and is exposed to the outside of the molded product. (3) A shield molded product according to claim 1 of the utility model registration claim in which a metal tape 6B is used as a metal lead, one end of which is bonded to the conductive layer 3 and the other end is exposed from the edge of the molded product. Conduction part 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16341786U JPS6370199U (en) | 1986-10-24 | 1986-10-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16341786U JPS6370199U (en) | 1986-10-24 | 1986-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6370199U true JPS6370199U (en) | 1988-05-11 |
Family
ID=31091596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16341786U Pending JPS6370199U (en) | 1986-10-24 | 1986-10-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6370199U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011001809A1 (en) * | 2009-07-03 | 2011-01-06 | 日本写真印刷株式会社 | Molding die for injection molding and method for producing composite product |
-
1986
- 1986-10-24 JP JP16341786U patent/JPS6370199U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011001809A1 (en) * | 2009-07-03 | 2011-01-06 | 日本写真印刷株式会社 | Molding die for injection molding and method for producing composite product |
JP2011011505A (en) * | 2009-07-03 | 2011-01-20 | Nissha Printing Co Ltd | Injection mold, and method for manufacturing composite article |
JP4633181B2 (en) * | 2009-07-03 | 2011-02-16 | 日本写真印刷株式会社 | Injection mold and method of manufacturing composite product |
KR101218912B1 (en) * | 2009-07-03 | 2013-01-04 | 니혼샤신 인사츠 가부시키가이샤 | Molding die for injection molding and method for producing composite product |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58115027U (en) | push button panel | |
JPS6370199U (en) | ||
JPS6217198U (en) | ||
JPS6370197U (en) | ||
JPS6370198U (en) | ||
JPS58193628U (en) | electronic components | |
JPS6370200U (en) | ||
JPS5967944U (en) | Resin-encapsulated semiconductor device | |
JPS6217199U (en) | ||
JPS59109155U (en) | electronic components | |
JPS6365246U (en) | ||
JPS60113621U (en) | electronic components | |
JPS5915515U (en) | Resin mold support member | |
JPS599532U (en) | electronic components | |
JPS5858346U (en) | semiconductor equipment | |
JPS58100116U (en) | Molding terminal structure | |
JPH0160543U (en) | ||
JPS6343447U (en) | ||
JPS6083204U (en) | variable resistor | |
JPS6078415U (en) | Molding structure of positioning protrusion in ornament | |
JPS63165859U (en) | ||
JPS6020566U (en) | Resin plated product | |
JPS6255353U (en) | ||
JPS6348170U (en) | ||
JPS589717U (en) | Manufacturing mold for resin molded coils |