JPH0160543U - - Google Patents
Info
- Publication number
- JPH0160543U JPH0160543U JP15631687U JP15631687U JPH0160543U JP H0160543 U JPH0160543 U JP H0160543U JP 15631687 U JP15631687 U JP 15631687U JP 15631687 U JP15631687 U JP 15631687U JP H0160543 U JPH0160543 U JP H0160543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- utility
- insulating sheet
- solid material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011343 solid material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図乃至第３図は本考案の半導体装置の一実
施例を示し、第１図は組立て前の斜視図、第２図
は組立て後の斜視図、第３図は第２図の―断
面図、第４図は従来の半導体装置の一例を示す構
成図である。
１…半導体チツプ（半導体部品）、２…絶縁シ
ート、３…端子、４…樹脂、５…固形材。
1 to 3 show an embodiment of the semiconductor device of the present invention, in which FIG. 1 is a perspective view before assembly, FIG. 2 is a perspective view after assembly, and FIG. 3 is a cross-section of FIG. 2. 4 are configuration diagrams showing an example of a conventional semiconductor device. 1... Semiconductor chip (semiconductor component), 2... Insulating sheet, 3... Terminal, 4... Resin, 5... Solid material.
Claims (1)
、半導体チツプ又は半導体パツケージ等の半導体
部材を取付け、この半導体部材が取付けられてい
る表面が内側となるように上記絶縁シートをほぼ
Ｕ字状に曲げ、内側の空間に絶縁性の固形材を固
着したことを特徴とする半導体装置。 (2) 固形材は樹脂を内側の空間に注入して固化
させたものより成ることを特徴とする実用新案登
録請求の範囲第１項記載の半導体装置。 (3) Ｕ字状に成形された絶縁シートにおける対
向片の先端に、外方に直角に折曲された接地片を
設け、この接地片の表面に端子を形成したことを
特徴とする実用新案登録請求の範囲第１項記載の
半導体装置。 (4) 両対向片の内側に半導体部材が設けられて
いることを特徴とする実用新案登録請求の範囲第
１項記載の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor component such as a semiconductor chip or a semiconductor package is attached to one surface of a flexible insulating sheet, and the above insulating sheet is placed so that the surface on which the semiconductor component is attached is on the inside. A semiconductor device characterized by a sheet bent into a substantially U-shape and an insulating solid material fixed to the inner space. (2) The semiconductor device according to claim 1, wherein the solid material is made of a resin injected into the inner space and solidified. (3) A utility model characterized in that a grounding piece bent outward at right angles is provided at the tip of the opposing piece of the U-shaped insulating sheet, and a terminal is formed on the surface of this grounding piece. A semiconductor device according to claim 1. (4) The semiconductor device according to claim 1 of the utility model registration, characterized in that a semiconductor member is provided inside both opposing pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15631687U JPH0160543U (en) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15631687U JPH0160543U (en) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160543U true JPH0160543U (en) | 1989-04-17 |
Family
ID=31434749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15631687U Pending JPH0160543U (en) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160543U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001026432A1 (en) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
-
1987
- 1987-10-13 JP JP15631687U patent/JPH0160543U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001026432A1 (en) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| US6867496B1 (en) | 1999-10-01 | 2005-03-15 | Seiko Epson Corporation | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
| US7009293B2 (en) | 1999-10-01 | 2006-03-07 | Seiko Epson Corporation | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0160543U (en) | ||
| JPS6379058U (en) | ||
| JPS6370199U (en) | ||
| JPH03106755U (en) | ||
| JPS6315033U (en) | ||
| JPS62167394U (en) | ||
| JPS6387781U (en) | ||
| JPS6166901U (en) | ||
| JPH0333971U (en) | ||
| JPS62195922U (en) | ||
| JPS6351541U (en) | ||
| JPH0430448U (en) | ||
| JPS61101931U (en) | ||
| JPS6315054U (en) | ||
| JPS60144251U (en) | semiconductor equipment | |
| JPS58164188U (en) | Structure of electrical equipment | |
| JPH0244411U (en) | ||
| JPH0455147U (en) | ||
| JPS5822863U (en) | electric brush | |
| JPH0253757U (en) | ||
| JPS6054367U (en) | Mounting structure of electronic components | |
| JPS61117271U (en) | ||
| JPS5836942U (en) | Insulator component penetration structure | |
| JPS61156421U (en) | ||
| JPH01160677U (en) |