JPS5498177A - Glass seal type semiconductor device - Google Patents

Glass seal type semiconductor device

Info

Publication number
JPS5498177A
JPS5498177A JP435878A JP435878A JPS5498177A JP S5498177 A JPS5498177 A JP S5498177A JP 435878 A JP435878 A JP 435878A JP 435878 A JP435878 A JP 435878A JP S5498177 A JPS5498177 A JP S5498177A
Authority
JP
Japan
Prior art keywords
heat sink
heat
pellet
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP435878A
Other languages
Japanese (ja)
Inventor
Shunji Koike
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP435878A priority Critical patent/JPS5498177A/en
Publication of JPS5498177A publication Critical patent/JPS5498177A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve the heat radiating property of glass seal system by inserting a heat conductive heat sink between semiconductor pellet and bottom substrate.
CONSTITUTION: Connect pellet 4 to copper heat sink plate 2 by means of gold paste 3. Firmly affix the heat sink plate to ceramic plate 6 with high melting point glass 5 and seal cap 10 with low melting point glass 7. Portions 2a of heat sink plate 2 are exposed and because of these exposed portions, the heat of pellet is radiated effectively to reduce the thermal resistance to 70W80°C/W, thus enabling to increase the output extensively.
COPYRIGHT: (C)1979,JPO&Japio
JP435878A 1978-01-20 1978-01-20 Glass seal type semiconductor device Pending JPS5498177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP435878A JPS5498177A (en) 1978-01-20 1978-01-20 Glass seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP435878A JPS5498177A (en) 1978-01-20 1978-01-20 Glass seal type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5498177A true JPS5498177A (en) 1979-08-02

Family

ID=11582156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP435878A Pending JPS5498177A (en) 1978-01-20 1978-01-20 Glass seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5498177A (en)

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