JPS5498177A - Glass seal type semiconductor device - Google Patents
Glass seal type semiconductor deviceInfo
- Publication number
- JPS5498177A JPS5498177A JP435878A JP435878A JPS5498177A JP S5498177 A JPS5498177 A JP S5498177A JP 435878 A JP435878 A JP 435878A JP 435878 A JP435878 A JP 435878A JP S5498177 A JPS5498177 A JP S5498177A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- pellet
- semiconductor device
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve the heat radiating property of glass seal system by inserting a heat conductive heat sink between semiconductor pellet and bottom substrate.
CONSTITUTION: Connect pellet 4 to copper heat sink plate 2 by means of gold paste 3. Firmly affix the heat sink plate to ceramic plate 6 with high melting point glass 5 and seal cap 10 with low melting point glass 7. Portions 2a of heat sink plate 2 are exposed and because of these exposed portions, the heat of pellet is radiated effectively to reduce the thermal resistance to 70W80°C/W, thus enabling to increase the output extensively.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP435878A JPS5498177A (en) | 1978-01-20 | 1978-01-20 | Glass seal type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP435878A JPS5498177A (en) | 1978-01-20 | 1978-01-20 | Glass seal type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5498177A true JPS5498177A (en) | 1979-08-02 |
Family
ID=11582156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP435878A Pending JPS5498177A (en) | 1978-01-20 | 1978-01-20 | Glass seal type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5498177A (en) |
-
1978
- 1978-01-20 JP JP435878A patent/JPS5498177A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0013314A3 (en) | Semiconductor device comprising a cooling body | |
JPS5498177A (en) | Glass seal type semiconductor device | |
JPS53131781A (en) | Condensing type solar battery device | |
JPS53126276A (en) | Heat dissipation construction of multichip mounting substrate | |
JPS54128277A (en) | Semiconductor device | |
JPS54111768A (en) | Semiconductor device of resin sealing type | |
JPS5314561A (en) | Packaging device of semiconductor device | |
JPS55107251A (en) | Electronic part and its packaging construction | |
JPS57194556A (en) | Heat radiating package | |
JPS5236980A (en) | Heat sink for semiconductor devices | |
JPS53135579A (en) | Liquid sealing semiconductor device | |
JPS5438771A (en) | Cooling fin | |
JPS54128675A (en) | Semiconductor device | |
JPS5568057A (en) | Electron gun | |
JPS52125272A (en) | Substrate to which semiconductor device is mounted | |
JPS52135678A (en) | Semiconductor device and its productions | |
JPS57192054A (en) | Heat radiating structure of leadless package | |
JPS5440583A (en) | Semiconductor device | |
JPS57121260A (en) | Semiconductor device | |
JPS52146563A (en) | Semiconductor device | |
JPS548469A (en) | Heat sink for stud type semiconductors | |
JPS52147971A (en) | Semiconductor device | |
JPS5264287A (en) | Group iii-v compound semiconductor element | |
JPS5493965A (en) | Semiconductor vessel | |
JPS5386168A (en) | Heat sink for semiconductor device |