JPS5787143A - Method for wire bonding - Google Patents

Method for wire bonding

Info

Publication number
JPS5787143A
JPS5787143A JP16202980A JP16202980A JPS5787143A JP S5787143 A JPS5787143 A JP S5787143A JP 16202980 A JP16202980 A JP 16202980A JP 16202980 A JP16202980 A JP 16202980A JP S5787143 A JPS5787143 A JP S5787143A
Authority
JP
Japan
Prior art keywords
point
capillary
raised
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16202980A
Other languages
Japanese (ja)
Inventor
Takashi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP16202980A priority Critical patent/JPS5787143A/en
Publication of JPS5787143A publication Critical patent/JPS5787143A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform the bonding of raised wire loop at a high speed by a method wherein a capillary is shifted from the first bonding point to the second bonding point in such a manner that the highest rising position describes an angular locus. CONSTITUTION:For example, after a wire has been press-connected to the first bonding point a on a pellet 1, the capillary is raised to point b, and then the capillary is shifted to point c which is the reverse direction to the second bonding point g on the outer lead 2. Then, after the cappilary has been raised to point d, it is raised diagonally to the highest rising position e of the height H, and after it has been lowered diagonally to point f directly above point g, it is lowered to the point g and the wire is press-cinnected. Through these procedures, a pellet short-circuit, a tab short-circuit and the like can be prevented by making the wire loop shape higher, and the shifting of the capillary can also be performed at a high speed.
JP16202980A 1980-11-19 1980-11-19 Method for wire bonding Pending JPS5787143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16202980A JPS5787143A (en) 1980-11-19 1980-11-19 Method for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16202980A JPS5787143A (en) 1980-11-19 1980-11-19 Method for wire bonding

Publications (1)

Publication Number Publication Date
JPS5787143A true JPS5787143A (en) 1982-05-31

Family

ID=15746714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16202980A Pending JPS5787143A (en) 1980-11-19 1980-11-19 Method for wire bonding

Country Status (1)

Country Link
JP (1) JPS5787143A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342135A (en) * 1986-08-08 1988-02-23 Shinkawa Ltd Wire bonding method
JPS63257236A (en) * 1987-04-14 1988-10-25 Mitsubishi Electric Corp Wire bonding
US5156323A (en) * 1991-02-27 1992-10-20 Kabushiki Kaisha Shinkawa Wire bonding method
US5192018A (en) * 1991-02-27 1993-03-09 Kabushiki Kaisha Shinkawa Wire bonding method
US5221037A (en) * 1991-08-08 1993-06-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
US5259548A (en) * 1991-06-19 1993-11-09 Kabushiki Kaisha Shinkawa Wire bonding method
US5524811A (en) * 1993-09-21 1996-06-11 Kabushiki Kaisha Shinkawa Wire bonding method
US5884830A (en) * 1996-08-21 1999-03-23 Kabushiki Kaisha Shinkawa Capillary for a wire bonding apparatus
US5906308A (en) * 1996-08-21 1999-05-25 Kabushiki Kaisha Shinkawa Capillary for use in a wire bonding apparatus
US6041995A (en) * 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6270000B1 (en) 1999-03-02 2001-08-07 Kabushiki Kaisha Shinkawa Wire bonding method
US6467678B2 (en) 1999-12-28 2002-10-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0560657B2 (en) * 1986-08-08 1993-09-02 Shinkawa Kk
JPS6342135A (en) * 1986-08-08 1988-02-23 Shinkawa Ltd Wire bonding method
JPH0523498B2 (en) * 1987-04-14 1993-04-02 Mitsubishi Electric Corp
JPS63257236A (en) * 1987-04-14 1988-10-25 Mitsubishi Electric Corp Wire bonding
US5192018A (en) * 1991-02-27 1993-03-09 Kabushiki Kaisha Shinkawa Wire bonding method
US5156323A (en) * 1991-02-27 1992-10-20 Kabushiki Kaisha Shinkawa Wire bonding method
US5259548A (en) * 1991-06-19 1993-11-09 Kabushiki Kaisha Shinkawa Wire bonding method
US5221037A (en) * 1991-08-08 1993-06-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
US5524811A (en) * 1993-09-21 1996-06-11 Kabushiki Kaisha Shinkawa Wire bonding method
US5884830A (en) * 1996-08-21 1999-03-23 Kabushiki Kaisha Shinkawa Capillary for a wire bonding apparatus
US5906308A (en) * 1996-08-21 1999-05-25 Kabushiki Kaisha Shinkawa Capillary for use in a wire bonding apparatus
US6041995A (en) * 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6270000B1 (en) 1999-03-02 2001-08-07 Kabushiki Kaisha Shinkawa Wire bonding method
US6467678B2 (en) 1999-12-28 2002-10-22 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus

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