JPS5364468A - Silver wire connecting method - Google Patents

Silver wire connecting method

Info

Publication number
JPS5364468A
JPS5364468A JP13958276A JP13958276A JPS5364468A JP S5364468 A JPS5364468 A JP S5364468A JP 13958276 A JP13958276 A JP 13958276A JP 13958276 A JP13958276 A JP 13958276A JP S5364468 A JPS5364468 A JP S5364468A
Authority
JP
Japan
Prior art keywords
wire connecting
silver wire
connecting method
silver
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13958276A
Other languages
Japanese (ja)
Inventor
Akira Kikuta
Tadashi Okubo
Hiroyuki Ishida
Osamu Kasahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13958276A priority Critical patent/JPS5364468A/en
Publication of JPS5364468A publication Critical patent/JPS5364468A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase the reliability of bonding of silver wires and solder or lead wires by performing welding in an inert atmosphere or reductive atmosphere not containing oxygen.
COPYRIGHT: (C)1978,JPO&Japio
JP13958276A 1976-11-22 1976-11-22 Silver wire connecting method Pending JPS5364468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13958276A JPS5364468A (en) 1976-11-22 1976-11-22 Silver wire connecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13958276A JPS5364468A (en) 1976-11-22 1976-11-22 Silver wire connecting method

Publications (1)

Publication Number Publication Date
JPS5364468A true JPS5364468A (en) 1978-06-08

Family

ID=15248607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13958276A Pending JPS5364468A (en) 1976-11-22 1976-11-22 Silver wire connecting method

Country Status (1)

Country Link
JP (1) JPS5364468A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110277A (en) * 1974-02-06 1975-08-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110277A (en) * 1974-02-06 1975-08-30

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