JPS52129281A - Lead wire for semiconductor device - Google Patents

Lead wire for semiconductor device

Info

Publication number
JPS52129281A
JPS52129281A JP4617276A JP4617276A JPS52129281A JP S52129281 A JPS52129281 A JP S52129281A JP 4617276 A JP4617276 A JP 4617276A JP 4617276 A JP4617276 A JP 4617276A JP S52129281 A JPS52129281 A JP S52129281A
Authority
JP
Japan
Prior art keywords
lead wire
semiconductor device
corrosion resistance
sufficient strength
provides sufficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4617276A
Other languages
Japanese (ja)
Other versions
JPS5753981B2 (en
Inventor
Hiroshi Ishibe
Nobuo Ogasa
Akira Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP4617276A priority Critical patent/JPS52129281A/en
Publication of JPS52129281A publication Critical patent/JPS52129281A/en
Publication of JPS5753981B2 publication Critical patent/JPS5753981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To obtain a lead wire which provides sufficient strength and corrosion resistance with small welding area by using a good conductor wire which makes easy metallurgical bonding to a chip secured to a semiconductor composed of Mo or W.
COPYRIGHT: (C)1977,JPO&Japio
JP4617276A 1976-04-22 1976-04-22 Lead wire for semiconductor device Granted JPS52129281A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4617276A JPS52129281A (en) 1976-04-22 1976-04-22 Lead wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4617276A JPS52129281A (en) 1976-04-22 1976-04-22 Lead wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS52129281A true JPS52129281A (en) 1977-10-29
JPS5753981B2 JPS5753981B2 (en) 1982-11-16

Family

ID=12739596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4617276A Granted JPS52129281A (en) 1976-04-22 1976-04-22 Lead wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS52129281A (en)

Also Published As

Publication number Publication date
JPS5753981B2 (en) 1982-11-16

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