JPS5323569A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5323569A
JPS5323569A JP9847876A JP9847876A JPS5323569A JP S5323569 A JPS5323569 A JP S5323569A JP 9847876 A JP9847876 A JP 9847876A JP 9847876 A JP9847876 A JP 9847876A JP S5323569 A JPS5323569 A JP S5323569A
Authority
JP
Japan
Prior art keywords
semiconductor device
autectic
substrateand
avert
automating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9847876A
Other languages
Japanese (ja)
Inventor
Tsukasa Hattori
Yoshio Yamamoto
Kuniyoshi Oe
Takayuki Minamiyama
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9847876A priority Critical patent/JPS5323569A/en
Publication of JPS5323569A publication Critical patent/JPS5323569A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

PURPOSE: To avert the production of cracking even at the time of die bonding by an autectic alloy method and make the device substantially adaptable for automating and speed changing by providing a polycrystalline semiconductor layer between a semiconductor substrateand a stem.
COPYRIGHT: (C)1978,JPO&Japio
JP9847876A 1976-08-18 1976-08-18 Semiconductor device Pending JPS5323569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9847876A JPS5323569A (en) 1976-08-18 1976-08-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9847876A JPS5323569A (en) 1976-08-18 1976-08-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5323569A true JPS5323569A (en) 1978-03-04

Family

ID=14220748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9847876A Pending JPS5323569A (en) 1976-08-18 1976-08-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5323569A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54156472A (en) * 1978-05-30 1979-12-10 Nec Corp Semiconductor integrated circuit device
JPS5518021A (en) * 1978-07-26 1980-02-07 Chiyou Lsi Gijutsu Kenkyu Kumiai Method of die bonding of semiconductor pellet
JPS55148468A (en) * 1979-05-07 1980-11-19 Nec Corp Diode
JPS56169337A (en) * 1980-05-29 1981-12-26 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6169122A (en) * 1984-09-12 1986-04-09 Nec Kansai Ltd Manufacture of semiconductor device
JPS61234041A (en) * 1985-04-09 1986-10-18 Tdk Corp Semiconductor device and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4966069A (en) * 1972-10-27 1974-06-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4966069A (en) * 1972-10-27 1974-06-26

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54156472A (en) * 1978-05-30 1979-12-10 Nec Corp Semiconductor integrated circuit device
JPS5518021A (en) * 1978-07-26 1980-02-07 Chiyou Lsi Gijutsu Kenkyu Kumiai Method of die bonding of semiconductor pellet
JPS55148468A (en) * 1979-05-07 1980-11-19 Nec Corp Diode
JPS56169337A (en) * 1980-05-29 1981-12-26 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6169122A (en) * 1984-09-12 1986-04-09 Nec Kansai Ltd Manufacture of semiconductor device
JPS61234041A (en) * 1985-04-09 1986-10-18 Tdk Corp Semiconductor device and manufacture thereof

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