JPS52140270A - Supersonic wire bonder - Google Patents

Supersonic wire bonder

Info

Publication number
JPS52140270A
JPS52140270A JP5650876A JP5650876A JPS52140270A JP S52140270 A JPS52140270 A JP S52140270A JP 5650876 A JP5650876 A JP 5650876A JP 5650876 A JP5650876 A JP 5650876A JP S52140270 A JPS52140270 A JP S52140270A
Authority
JP
Japan
Prior art keywords
wire bonder
supersonic
supersonic wire
exfoliation
defective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5650876A
Other languages
Japanese (ja)
Inventor
Osami Asai
Shunichiro Fujioka
Shunei Uematsu
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5650876A priority Critical patent/JPS52140270A/en
Publication of JPS52140270A publication Critical patent/JPS52140270A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE: To decrease the occurrence of defective exfoliation as well as to secure a high speed for the junction cycle by giving a low speed to the cam revolution only at the tool operation time.
COPYRIGHT: (C)1977,JPO&Japio
JP5650876A 1976-05-19 1976-05-19 Supersonic wire bonder Pending JPS52140270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5650876A JPS52140270A (en) 1976-05-19 1976-05-19 Supersonic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5650876A JPS52140270A (en) 1976-05-19 1976-05-19 Supersonic wire bonder

Publications (1)

Publication Number Publication Date
JPS52140270A true JPS52140270A (en) 1977-11-22

Family

ID=13029057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5650876A Pending JPS52140270A (en) 1976-05-19 1976-05-19 Supersonic wire bonder

Country Status (1)

Country Link
JP (1) JPS52140270A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5457863A (en) * 1977-10-18 1979-05-10 Toshiba Corp Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5457863A (en) * 1977-10-18 1979-05-10 Toshiba Corp Wire bonding device

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