JPS6484653A - Method for soldering terminals to package mounted with electronic part - Google Patents

Method for soldering terminals to package mounted with electronic part

Info

Publication number
JPS6484653A
JPS6484653A JP24205087A JP24205087A JPS6484653A JP S6484653 A JPS6484653 A JP S6484653A JP 24205087 A JP24205087 A JP 24205087A JP 24205087 A JP24205087 A JP 24205087A JP S6484653 A JPS6484653 A JP S6484653A
Authority
JP
Japan
Prior art keywords
terminal
electronic part
section
soldering
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24205087A
Other languages
Japanese (ja)
Other versions
JP2535035B2 (en
Inventor
Muneisa Yamada
Toru Higuchi
Takeshi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62242050A priority Critical patent/JP2535035B2/en
Publication of JPS6484653A publication Critical patent/JPS6484653A/en
Application granted granted Critical
Publication of JP2535035B2 publication Critical patent/JP2535035B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve on productivity in a soldering process by a method wherein a bonding section or an electronic part mount is formed receding from terminals and then the package is allowed to go into molten solder for soldering terminal parts to a terminal section. CONSTITUTION:On one and the same side of a plastic package 1, a terminal section 3 whereto terminal parts 2 such as terminal pins 2a are to be soldered, a bonding section 4 whereto electronic parts are to be bonded, and an electronic part mount 5 whereon electronic parts are to be installed are provided. The bonding section 4 and the electronic part mount 5 are built receding from the terminal 3. The plastic package 1 is allowed to be inserted into the solder 6 with the surfaces of the solder 6 and of the plastic package 1 kept parallel to each other. In this process, the terminal pins 2a are soldered to the terminal section 4. By using this method, productivity is enhanced in the soldering work.
JP62242050A 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts Expired - Lifetime JP2535035B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242050A JP2535035B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242050A JP2535035B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Publications (2)

Publication Number Publication Date
JPS6484653A true JPS6484653A (en) 1989-03-29
JP2535035B2 JP2535035B2 (en) 1996-09-18

Family

ID=17083525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242050A Expired - Lifetime JP2535035B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Country Status (1)

Country Link
JP (1) JP2535035B2 (en)

Also Published As

Publication number Publication date
JP2535035B2 (en) 1996-09-18

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