JPS6484652A - Method for soldering terminals to package mounted with electronic part - Google Patents

Method for soldering terminals to package mounted with electronic part

Info

Publication number
JPS6484652A
JPS6484652A JP24204887A JP24204887A JPS6484652A JP S6484652 A JPS6484652 A JP S6484652A JP 24204887 A JP24204887 A JP 24204887A JP 24204887 A JP24204887 A JP 24204887A JP S6484652 A JPS6484652 A JP S6484652A
Authority
JP
Japan
Prior art keywords
terminal
package
plastic package
solder
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24204887A
Other languages
Japanese (ja)
Other versions
JP2535034B2 (en
Inventor
Muneisa Yamada
Toru Higuchi
Takeshi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62242048A priority Critical patent/JP2535034B2/en
Publication of JPS6484652A publication Critical patent/JPS6484652A/en
Application granted granted Critical
Publication of JP2535034B2 publication Critical patent/JP2535034B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve on productivity in a soldering process by a method wherein a package is put in molten solder with the surfaces of the solder and of the package maintained roughly parallel to each other for the soldering of terminal parts to their stations. CONSTITUTION:On one and the same side of a plastic package 1, a terminal section 3 whereto terminal parts 2 such as terminal pins 2a are to be soldered, a bonding section 4 whereto electronic parts are to be bonded, and an electronic part mount 5 whereon electronic parts are to be installed are provided, all facing inward. A frame 7 is attached to a site between the terminal section 3 and the bonding section 4, along the entire circumference. The plastic package 1 is allowed to go into a pool of molten solder 6, with the surfaces of the solder 6 and of the plastic package 1 kept roughly parallel to each other. The plastic package 1 is then allowed to come away from the molten solder 6, with the pins 2a soldered to the terminal section 3. This method improve the productivity of a soldering process.
JP62242048A 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts Expired - Lifetime JP2535034B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242048A JP2535034B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242048A JP2535034B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Publications (2)

Publication Number Publication Date
JPS6484652A true JPS6484652A (en) 1989-03-29
JP2535034B2 JP2535034B2 (en) 1996-09-18

Family

ID=17083494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242048A Expired - Lifetime JP2535034B2 (en) 1987-09-26 1987-09-26 Soldering method of terminal parts to package with electronic parts

Country Status (1)

Country Link
JP (1) JP2535034B2 (en)

Also Published As

Publication number Publication date
JP2535034B2 (en) 1996-09-18

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