JPS6484652A - Method for soldering terminals to package mounted with electronic part - Google Patents
Method for soldering terminals to package mounted with electronic partInfo
- Publication number
- JPS6484652A JPS6484652A JP24204887A JP24204887A JPS6484652A JP S6484652 A JPS6484652 A JP S6484652A JP 24204887 A JP24204887 A JP 24204887A JP 24204887 A JP24204887 A JP 24204887A JP S6484652 A JPS6484652 A JP S6484652A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- package
- plastic package
- solder
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To improve on productivity in a soldering process by a method wherein a package is put in molten solder with the surfaces of the solder and of the package maintained roughly parallel to each other for the soldering of terminal parts to their stations. CONSTITUTION:On one and the same side of a plastic package 1, a terminal section 3 whereto terminal parts 2 such as terminal pins 2a are to be soldered, a bonding section 4 whereto electronic parts are to be bonded, and an electronic part mount 5 whereon electronic parts are to be installed are provided, all facing inward. A frame 7 is attached to a site between the terminal section 3 and the bonding section 4, along the entire circumference. The plastic package 1 is allowed to go into a pool of molten solder 6, with the surfaces of the solder 6 and of the plastic package 1 kept roughly parallel to each other. The plastic package 1 is then allowed to come away from the molten solder 6, with the pins 2a soldered to the terminal section 3. This method improve the productivity of a soldering process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242048A JP2535034B2 (en) | 1987-09-26 | 1987-09-26 | Soldering method of terminal parts to package with electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242048A JP2535034B2 (en) | 1987-09-26 | 1987-09-26 | Soldering method of terminal parts to package with electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6484652A true JPS6484652A (en) | 1989-03-29 |
JP2535034B2 JP2535034B2 (en) | 1996-09-18 |
Family
ID=17083494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62242048A Expired - Lifetime JP2535034B2 (en) | 1987-09-26 | 1987-09-26 | Soldering method of terminal parts to package with electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2535034B2 (en) |
-
1987
- 1987-09-26 JP JP62242048A patent/JP2535034B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2535034B2 (en) | 1996-09-18 |
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