JPS5791548A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5791548A
JPS5791548A JP16923680A JP16923680A JPS5791548A JP S5791548 A JPS5791548 A JP S5791548A JP 16923680 A JP16923680 A JP 16923680A JP 16923680 A JP16923680 A JP 16923680A JP S5791548 A JPS5791548 A JP S5791548A
Authority
JP
Japan
Prior art keywords
lead frame
electrode
substrate
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16923680A
Other languages
Japanese (ja)
Inventor
Eiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16923680A priority Critical patent/JPS5791548A/en
Publication of JPS5791548A publication Critical patent/JPS5791548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Abstract

PURPOSE:To improve the removal processing of stress and workability of a hybrid integrated circuit by bending the connecting part of a lead frame to an electrode at the center. CONSTITUTION:A connecting part 12 of a substrate 2 to an electrode 3 is provided, and is bent in advance to a lead frame 11 vertically with respect to the substrate 2. Then, the electrode 3 preliminarily soldered at 8 is positioned, the substrate 2 disposed with the lead frame 11 is placed on a hot plate heated at a temperature higher than the solder melting temperature to melt the solder 8 so as to complete the soldering. Thereafter, a frame 5 having an external lead wire 4 is secured with an adhesive 6, and the other end of the lead frame 11 is soldered to the external lead wire 4. Subsequently, a tie-bar 10 is cut to complete the work.
JP16923680A 1980-11-28 1980-11-28 Manufacture of hybrid integrated circuit Pending JPS5791548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16923680A JPS5791548A (en) 1980-11-28 1980-11-28 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16923680A JPS5791548A (en) 1980-11-28 1980-11-28 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5791548A true JPS5791548A (en) 1982-06-07

Family

ID=15882752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16923680A Pending JPS5791548A (en) 1980-11-28 1980-11-28 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5791548A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134859U (en) * 1991-06-07 1992-12-15 サンケン電気株式会社 Wiring electrode body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134859U (en) * 1991-06-07 1992-12-15 サンケン電気株式会社 Wiring electrode body

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