JPS56114341A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS56114341A
JPS56114341A JP1693080A JP1693080A JPS56114341A JP S56114341 A JPS56114341 A JP S56114341A JP 1693080 A JP1693080 A JP 1693080A JP 1693080 A JP1693080 A JP 1693080A JP S56114341 A JPS56114341 A JP S56114341A
Authority
JP
Japan
Prior art keywords
tool
heated
fixed
solder
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1693080A
Other languages
Japanese (ja)
Inventor
Yoichiro Onishi
Toshio Hida
Toshio Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1693080A priority Critical patent/JPS56114341A/en
Publication of JPS56114341A publication Critical patent/JPS56114341A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To bond lead wires stably and in excellent productivity by a method wherein a bonding section is mechanically fixed by means of a tool having a fixed temperature, the tool or the tool and the lead wires are heated in pulsating manner and then the tool is separated. CONSTITUTION:A solder film is formed on a metallic film 2a on a glass plate 1, a lead wire 3a plated with solder is stacked thereon, the lead wire is pushed by means of a bonding tool 40 and the location is fixed. The tool 40 is heated at or below the melting point of solder by conducting a coil 6. Pulsating currents are flowed, the tool 40 is heated in a pulsating manner, the solder coating is melted, a bonding section 5 is made up and the tool 40 is separated. According to such constituion, the bonding sections are mechanically stable and the leads are not short-circuitted with adjacent leads because the lead wires are fixed at the fixed locations of the metallic films by means of the tool, and the bonding sections are quickly heated and cooled and the productivity is excellent because the tool is heated in a pulsating manner.
JP1693080A 1980-02-13 1980-02-13 Bonding method Pending JPS56114341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1693080A JPS56114341A (en) 1980-02-13 1980-02-13 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1693080A JPS56114341A (en) 1980-02-13 1980-02-13 Bonding method

Publications (1)

Publication Number Publication Date
JPS56114341A true JPS56114341A (en) 1981-09-08

Family

ID=11929836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1693080A Pending JPS56114341A (en) 1980-02-13 1980-02-13 Bonding method

Country Status (1)

Country Link
JP (1) JPS56114341A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137581A (en) * 1988-04-21 1989-05-30 Casio Comput Co Ltd Connection of ic chip lead
JPH0422046A (en) * 1990-05-17 1992-01-27 Mitsui High Tec Inc Manufacture of lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137581A (en) * 1988-04-21 1989-05-30 Casio Comput Co Ltd Connection of ic chip lead
JPH0422046A (en) * 1990-05-17 1992-01-27 Mitsui High Tec Inc Manufacture of lead frame

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