JPS5693347A - Manufacture of airtight glass terminal - Google Patents
Manufacture of airtight glass terminalInfo
- Publication number
- JPS5693347A JPS5693347A JP17004779A JP17004779A JPS5693347A JP S5693347 A JPS5693347 A JP S5693347A JP 17004779 A JP17004779 A JP 17004779A JP 17004779 A JP17004779 A JP 17004779A JP S5693347 A JPS5693347 A JP S5693347A
- Authority
- JP
- Japan
- Prior art keywords
- eyelet
- die
- glasses
- stage
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Glass Compositions (AREA)
Abstract
PURPOSE:To obtain the airtight glass teminal by disposing glasses at terminal lead-out means of an eyelet, inserting leads therebetween, disposing a silver-plated die-casting and heatint the glasses to be melted. CONSTITUTION:Soda-lime glasses 2 are arranged in the terminal lead-out means of the eyelet 1 such as Fe and the lead terminals 3 of Fe-Ni are inserted thereinto. An Mo diestage 4 is prepared of which Ag layer 5 is formed on the surface of the die- stage which is fixedly attached to the eyelet, the eyelet, glasses, lead terminals are housed in a jig 6, and the die-stage is housed in a jig 7 to be faced to the former. The glasses 2 are heated to be melted at about 1,000 deg.C in N2 or H2, the eyelet and lead terminals are deposited airtightly and also melting of the Ag layer 5 makes the die-stage be fixedly attached to the eyelet. With this construction, the leads are deposited in the eyelet in high precision and the die-stage is soldered and the process is shortened to improve the yield.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17004779A JPS5693347A (en) | 1979-12-26 | 1979-12-26 | Manufacture of airtight glass terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17004779A JPS5693347A (en) | 1979-12-26 | 1979-12-26 | Manufacture of airtight glass terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5693347A true JPS5693347A (en) | 1981-07-28 |
Family
ID=15897624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17004779A Pending JPS5693347A (en) | 1979-12-26 | 1979-12-26 | Manufacture of airtight glass terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5693347A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5836011A (en) * | 1981-08-26 | 1983-03-02 | Fuji Denka:Kk | Glass sealing method for airtight package of circuit element |
JPS59172256A (en) * | 1983-03-19 | 1984-09-28 | Shinko Electric Ind Co Ltd | Glass terminal with heat sink for semiconductor package and manufacture thereof and incorporating jig used for said method |
-
1979
- 1979-12-26 JP JP17004779A patent/JPS5693347A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5836011A (en) * | 1981-08-26 | 1983-03-02 | Fuji Denka:Kk | Glass sealing method for airtight package of circuit element |
JPS59172256A (en) * | 1983-03-19 | 1984-09-28 | Shinko Electric Ind Co Ltd | Glass terminal with heat sink for semiconductor package and manufacture thereof and incorporating jig used for said method |
JPH0437588B2 (en) * | 1983-03-19 | 1992-06-19 | Shinko Elec Ind |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5693347A (en) | Manufacture of airtight glass terminal | |
US2334020A (en) | Glass-to-metal seal | |
GB583242A (en) | Improvements relating to the manufacture of glazed electrical orifices for use in connection with wave-guides | |
JPS57111056A (en) | Semiconductor device | |
JPS6482430A (en) | Manufacture of magnetron | |
JPS5469068A (en) | Semiconductor device and its manufacture | |
JPS5791548A (en) | Manufacture of hybrid integrated circuit | |
SE7906386L (en) | SET TO MANUFACTURE METAL ALLOYS | |
JPS57115012A (en) | Glass sealed quartz oscillator and its manufacture | |
JPS63240051A (en) | Ceramic cap | |
JPS5758345A (en) | Manufacture of airtight terminal | |
JPS57176641A (en) | Manufacture of color picture tube | |
JPS57112115A (en) | Microminiaturized quartz oscillator | |
GB239871A (en) | Improvements in and relating to means for making gas-tight joints between metal and glass or quartz | |
JPS57170612A (en) | Mounting method for glass-sealed quartz oscillator | |
JPS5466573A (en) | Method of fabricating miniature bulb | |
JPS57122555A (en) | Glass sealed metallic piece electrode | |
JPS5758370A (en) | Photo device | |
JPS567456A (en) | Manufacture of airtight sealing body | |
GB1478448A (en) | Method of making an hermetically sealed terminal | |
JPS5232666A (en) | Manufacturing process of fluorescent display tube | |
JPS5576537A (en) | Directly-heated composite cathode structure and manufacturing method thereof | |
JPH0230018B2 (en) | HIKARITSUSHINYOSHUKOKINOSEIZOHOHO | |
JPS556245A (en) | Thermister bolometer | |
JPS5661153A (en) | Connection of lead wire |