JPS5661153A - Connection of lead wire - Google Patents

Connection of lead wire

Info

Publication number
JPS5661153A
JPS5661153A JP13688179A JP13688179A JPS5661153A JP S5661153 A JPS5661153 A JP S5661153A JP 13688179 A JP13688179 A JP 13688179A JP 13688179 A JP13688179 A JP 13688179A JP S5661153 A JPS5661153 A JP S5661153A
Authority
JP
Japan
Prior art keywords
lead wire
board
metal
attaching
preprocessing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13688179A
Other languages
Japanese (ja)
Other versions
JPS6227550B2 (en
Inventor
Hidehiko Akasaki
Mamoru Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13688179A priority Critical patent/JPS5661153A/en
Publication of JPS5661153A publication Critical patent/JPS5661153A/en
Publication of JPS6227550B2 publication Critical patent/JPS6227550B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify a package manufacturing process to make unnecessary the preprocessing of attaching nickel by a method wherein a conductor composed of a metal having a high melting point is formed on an insulating board when attaching an external lead wire to the board, and the lead wire is connected to the surface of the board at processing temperatures of 900-1,000 deg.C. CONSTITUTION:When soldering an external lead wire 4 made of kovar to an insulating board 1 using hard solder 5, a metal 3 having a high melting point such as W is first attached to the board 1. Then, the lead wire 4 is fixed onto the metal by means of heat processing at 900-1,000 deg.C. By so doing, the preprocessing of attaching Ni conventionally conducted is unnecessary because high close surface adhesion is provided with the lead wire 4, thus making simple the package manufacturing process and increasing the yielding rate by about 10%.
JP13688179A 1979-10-23 1979-10-23 Connection of lead wire Granted JPS5661153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13688179A JPS5661153A (en) 1979-10-23 1979-10-23 Connection of lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13688179A JPS5661153A (en) 1979-10-23 1979-10-23 Connection of lead wire

Publications (2)

Publication Number Publication Date
JPS5661153A true JPS5661153A (en) 1981-05-26
JPS6227550B2 JPS6227550B2 (en) 1987-06-15

Family

ID=15185717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13688179A Granted JPS5661153A (en) 1979-10-23 1979-10-23 Connection of lead wire

Country Status (1)

Country Link
JP (1) JPS5661153A (en)

Also Published As

Publication number Publication date
JPS6227550B2 (en) 1987-06-15

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