JPS5351967A - Bonding terminal formation method - Google Patents

Bonding terminal formation method

Info

Publication number
JPS5351967A
JPS5351967A JP12647676A JP12647676A JPS5351967A JP S5351967 A JPS5351967 A JP S5351967A JP 12647676 A JP12647676 A JP 12647676A JP 12647676 A JP12647676 A JP 12647676A JP S5351967 A JPS5351967 A JP S5351967A
Authority
JP
Japan
Prior art keywords
bonding terminal
formation method
terminal formation
solder
flowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12647676A
Other languages
Japanese (ja)
Inventor
Yoshimasa Miura
Minoru Takahashi
Seiji Yoneoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12647676A priority Critical patent/JPS5351967A/en
Publication of JPS5351967A publication Critical patent/JPS5351967A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Abstract

PURPOSE: To prevent the solder from flowing from the conductor opposing surface with pressing and heating by providing concave on the lead wire bonding parts, and to make the bonding terminal with a good mechanical and electrical connection and without causing short-circuit due to flown solder.
COPYRIGHT: (C)1978,JPO&Japio
JP12647676A 1976-10-21 1976-10-21 Bonding terminal formation method Pending JPS5351967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12647676A JPS5351967A (en) 1976-10-21 1976-10-21 Bonding terminal formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12647676A JPS5351967A (en) 1976-10-21 1976-10-21 Bonding terminal formation method

Publications (1)

Publication Number Publication Date
JPS5351967A true JPS5351967A (en) 1978-05-11

Family

ID=14936153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12647676A Pending JPS5351967A (en) 1976-10-21 1976-10-21 Bonding terminal formation method

Country Status (1)

Country Link
JP (1) JPS5351967A (en)

Similar Documents

Publication Publication Date Title
JPS521489A (en) Press-attached terminal for aluminium wire
JPS5351967A (en) Bonding terminal formation method
JPS52154358A (en) Production of semiconductor device
JPS535720A (en) Coil electric device
JPS51132973A (en) Semiconductor device
JPS5215289A (en) Method of manufacturing ultraconductive hollow conductor
JPS5341792A (en) Repeating terminal device
JPS51138522A (en) Solderable copper alloy having high electric conductivity
JPS5339490A (en) Production method of solderless terminal for aluminum conductor
JPS5210715A (en) Multi-element type magnetic head
JPS5265884A (en) Terminal
JPS53124072A (en) Semiconductor device
JPS5279657A (en) Wire bonding device
JPS5348464A (en) Lead wire mounting method for compound semiconductor element
JPS5258391A (en) Piezo electric element
JPS5287687A (en) Method for connecting enameled wire to terminal
JPS51149584A (en) Connecting method of a terminal
JPS5317274A (en) Electrode structure of semiconductor element
JPS5297671A (en) Semiconductor device
JPS5310034A (en) Wire service entrance device of heat proof distribution and power board
JPS52142286A (en) Connection of copper made lead wire and stainless steel made conductor
JPS528489A (en) Wire contact element with unnecessity of soldering
JPS5348462A (en) Wire bonding method
JPS52108774A (en) Fitting material for integrated circuit
JPS5295084A (en) Terminal for electric parts