JPS5539617A - Manufacturing of glass mold type diode - Google Patents

Manufacturing of glass mold type diode

Info

Publication number
JPS5539617A
JPS5539617A JP11223978A JP11223978A JPS5539617A JP S5539617 A JPS5539617 A JP S5539617A JP 11223978 A JP11223978 A JP 11223978A JP 11223978 A JP11223978 A JP 11223978A JP S5539617 A JPS5539617 A JP S5539617A
Authority
JP
Japan
Prior art keywords
solder
glass
covered
pellet
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11223978A
Other languages
Japanese (ja)
Inventor
Mitsusachi Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11223978A priority Critical patent/JPS5539617A/en
Publication of JPS5539617A publication Critical patent/JPS5539617A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To obtain a glass sealed diode which has good reverse direction characteristics by covering with an Ag-Cu solder prior to an etching of an assembly, and then immersing in an etching agent.
CONSTITUTION: A Cu reed 11 and a Mo electrode 13 are combined by means of Ag-Cu solder 12, then covered with a glass slurry 21 and the slurry is fired. A pellet 22 is fixed by means of a high temperature treatment to the electrode reed covered with the glass, and this assembly is etched in an acid for obtaining a required reverse direction withstand voltage. Then the pellet is covered with a glass slurry and it is fired. By so doing, the solder is not etched when the assembly is etched because the Ag-Cu solder is covered. Thus Ag or Cu is prevented from adhering on the pellet. This increases reverse direction withstand voltage. In addition, the Ag-Cu solder enables to obtain a glass sealed diode that has good antimoisture characteristics and adhesiveness between a reed and an electrode.
COPYRIGHT: (C)1980,JPO&Japio
JP11223978A 1978-09-14 1978-09-14 Manufacturing of glass mold type diode Pending JPS5539617A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11223978A JPS5539617A (en) 1978-09-14 1978-09-14 Manufacturing of glass mold type diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11223978A JPS5539617A (en) 1978-09-14 1978-09-14 Manufacturing of glass mold type diode

Publications (1)

Publication Number Publication Date
JPS5539617A true JPS5539617A (en) 1980-03-19

Family

ID=14581718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11223978A Pending JPS5539617A (en) 1978-09-14 1978-09-14 Manufacturing of glass mold type diode

Country Status (1)

Country Link
JP (1) JPS5539617A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62502813A (en) * 1985-05-10 1987-11-12 トレフイメト− New alloys with high electrical and mechanical properties, processes for their production and their use in particular in electrical, electronic and related fields
JPS62296304A (en) * 1986-06-16 1987-12-23 古河電気工業株式会社 Composite for electronic/electric equipment and manufacture thereof
JPH0320815U (en) * 1989-07-12 1991-02-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62502813A (en) * 1985-05-10 1987-11-12 トレフイメト− New alloys with high electrical and mechanical properties, processes for their production and their use in particular in electrical, electronic and related fields
JPS62296304A (en) * 1986-06-16 1987-12-23 古河電気工業株式会社 Composite for electronic/electric equipment and manufacture thereof
JPH0320815U (en) * 1989-07-12 1991-02-28

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