JPS575347A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS575347A
JPS575347A JP7900680A JP7900680A JPS575347A JP S575347 A JPS575347 A JP S575347A JP 7900680 A JP7900680 A JP 7900680A JP 7900680 A JP7900680 A JP 7900680A JP S575347 A JPS575347 A JP S575347A
Authority
JP
Japan
Prior art keywords
carbon fiber
copper
twisted wire
semiconductor device
collars
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7900680A
Other languages
Japanese (ja)
Inventor
Toru Fukazawa
Masao Tsuruoka
Katsumi Akabane
Tadashi Sakagami
Toshiki Yagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP7900680A priority Critical patent/JPS575347A/en
Publication of JPS575347A publication Critical patent/JPS575347A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the airtightness of a semiconductor device by providing good soldable twisted wire at the part in which a copper-carbon fiber composite electrode is secured to the collar formed at the periphery and soldering the electrode via the twisted wire to the collar. CONSTITUTION:A copper plating is carried out on a carbon fiber, fine copper powder is diffused in aqueous methyl cellulose solution, copper as matrix is bonded via the solution to the carbon fiber, is wound on a core rod 9 to form copper-carbon fiber composite electrodes 2, 3, a semiconductor substrate 1 having at least one P-N junction is soldered therebetween, the twisted wire 10 at the periphery of the electrodes 2, 3 are connected via solder to the collars 4, 5, a heat insulating material 7 is provided between the collars 4 and 5, and the substrate 1 is airtightly sealed with resin 6. In this manner, since the solder is performed with the twisted wire, it can be readily carried out, its sealing property can be increased, and excellent semiconductor device can be obtained.
JP7900680A 1980-06-13 1980-06-13 Semiconductor device Pending JPS575347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7900680A JPS575347A (en) 1980-06-13 1980-06-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7900680A JPS575347A (en) 1980-06-13 1980-06-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS575347A true JPS575347A (en) 1982-01-12

Family

ID=13677857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7900680A Pending JPS575347A (en) 1980-06-13 1980-06-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS575347A (en)

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