JPS57121255A - Electric circuit element with metallic bump and mounting method of the seme - Google Patents

Electric circuit element with metallic bump and mounting method of the seme

Info

Publication number
JPS57121255A
JPS57121255A JP638981A JP638981A JPS57121255A JP S57121255 A JPS57121255 A JP S57121255A JP 638981 A JP638981 A JP 638981A JP 638981 A JP638981 A JP 638981A JP S57121255 A JPS57121255 A JP S57121255A
Authority
JP
Japan
Prior art keywords
film
spacer
chip body
circuit
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP638981A
Inventor
Minoru Honda
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP638981A priority Critical patent/JPS57121255A/en
Publication of JPS57121255A publication Critical patent/JPS57121255A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Abstract

PURPOSE:To improve the reliability in mounting an electric circuit element and to reduce the number of steps of mounting the element by providing a spacer film on a protective film of an IC chip body, further covering a film wire on the spacer film, connecting one end of the film wire to the circuit electrode of the chip body, and providing a metallic bump electrode at the other end of the wire. CONSTITUTION:A spacer 7 made of polyimide resin or the like is formed on a portion except the connecting parts of the circuit electrodes 2A, 2B on an IC chip body 1, and film wires 8A, 8B formed with solder metallic bump electrodes 9A, 9B are formed on the spacer. In order to mount the wires on a ceramic ciruit board 6, the chip body 1 is positioned on the circuit electrodes 5A, 5B on a ceramic circuit substrate 6, the bump electrodes are heated, molten and connected, and spacer 7 is removed with resin etchant. Accordingly, the thermal strain of the solder bump electrodes at the heating and melting time due to mechanical strength of the wires 8A, 8B can be absorbed.
JP638981A 1981-01-21 1981-01-21 Electric circuit element with metallic bump and mounting method of the seme Pending JPS57121255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP638981A JPS57121255A (en) 1981-01-21 1981-01-21 Electric circuit element with metallic bump and mounting method of the seme

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP638981A JPS57121255A (en) 1981-01-21 1981-01-21 Electric circuit element with metallic bump and mounting method of the seme

Publications (1)

Publication Number Publication Date
JPS57121255A true JPS57121255A (en) 1982-07-28

Family

ID=11637013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP638981A Pending JPS57121255A (en) 1981-01-21 1981-01-21 Electric circuit element with metallic bump and mounting method of the seme

Country Status (1)

Country Link
JP (1) JPS57121255A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465878B2 (en) 1995-10-31 2002-10-15 Tessera, Inc. Compliant microelectronic assemblies
US6906422B2 (en) 1998-10-28 2005-06-14 Tessera, Inc. Microelectronic elements with deformable leads
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device
US7750462B1 (en) 1999-10-12 2010-07-06 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
US8179215B2 (en) 2000-11-29 2012-05-15 Microassembly Technologies, Inc. MEMS device with integral packaging

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465878B2 (en) 1995-10-31 2002-10-15 Tessera, Inc. Compliant microelectronic assemblies
US6847101B2 (en) 1995-10-31 2005-01-25 Tessera, Inc. Microelectronic package having a compliant layer with bumped protrusions
US6847107B2 (en) 1995-10-31 2005-01-25 Tessera, Inc. Image forming apparatus with improved transfer efficiency
US7112879B2 (en) 1995-10-31 2006-09-26 Tessera, Inc. Microelectronic assemblies having compliant layers
US6906422B2 (en) 1998-10-28 2005-06-14 Tessera, Inc. Microelectronic elements with deformable leads
US7750462B1 (en) 1999-10-12 2010-07-06 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
US8179215B2 (en) 2000-11-29 2012-05-15 Microassembly Technologies, Inc. MEMS device with integral packaging
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device

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