JPS55113356A - Manufacture of electronic circuit and multilead frame - Google Patents

Manufacture of electronic circuit and multilead frame

Info

Publication number
JPS55113356A
JPS55113356A JP1982779A JP1982779A JPS55113356A JP S55113356 A JPS55113356 A JP S55113356A JP 1982779 A JP1982779 A JP 1982779A JP 1982779 A JP1982779 A JP 1982779A JP S55113356 A JPS55113356 A JP S55113356A
Authority
JP
Japan
Prior art keywords
lead
frame
multilead
chip
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982779A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1982779A priority Critical patent/JPS55113356A/en
Publication of JPS55113356A publication Critical patent/JPS55113356A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify classified display process by a method wherein a semiconductor element under the condition of multiframes is assembled and is sealed with resin, then its characteristics are examined, and based on the result, a bend, a cut or a hole is provided on lead pieces provided on a frame. CONSTITUTION:Multilead frame 1 is provided. A semiconductor chip is fixed on the tub provided on this. Wire bonding is operated between electrode and lead 4. Next, molding is operated on the chip and a part of the lead by using resin 2. Surrounding lead parts 7 are separated from frame 1. Their ends are bent. Subsequently, the electric characteristics of the chip are measured through the lead. Based on the result, a part of the lead piece of the corner part is bent as shown in 5a-5c, for classified display. By this, re-detection after storage is simplified.
JP1982779A 1979-02-23 1979-02-23 Manufacture of electronic circuit and multilead frame Pending JPS55113356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982779A JPS55113356A (en) 1979-02-23 1979-02-23 Manufacture of electronic circuit and multilead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982779A JPS55113356A (en) 1979-02-23 1979-02-23 Manufacture of electronic circuit and multilead frame

Publications (1)

Publication Number Publication Date
JPS55113356A true JPS55113356A (en) 1980-09-01

Family

ID=12010120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982779A Pending JPS55113356A (en) 1979-02-23 1979-02-23 Manufacture of electronic circuit and multilead frame

Country Status (1)

Country Link
JP (1) JPS55113356A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868635A (en) * 1988-01-13 1989-09-19 Texas Instruments Incorporated Lead frame for integrated circuit
KR20000006167A (en) * 1998-06-19 2000-01-25 클라크 3세 존 엠. Method of making integrated circuit packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868635A (en) * 1988-01-13 1989-09-19 Texas Instruments Incorporated Lead frame for integrated circuit
KR20000006167A (en) * 1998-06-19 2000-01-25 클라크 3세 존 엠. Method of making integrated circuit packages

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