JPS5559749A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5559749A
JPS5559749A JP13163978A JP13163978A JPS5559749A JP S5559749 A JPS5559749 A JP S5559749A JP 13163978 A JP13163978 A JP 13163978A JP 13163978 A JP13163978 A JP 13163978A JP S5559749 A JPS5559749 A JP S5559749A
Authority
JP
Japan
Prior art keywords
frame
tie
bar
lead
outer frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13163978A
Other languages
Japanese (ja)
Other versions
JPS6238863B2 (en
Inventor
Kazuo Shimizu
Kazuo Hoya
Fumihito Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13163978A priority Critical patent/JPS5559749A/en
Publication of JPS5559749A publication Critical patent/JPS5559749A/en
Publication of JPS6238863B2 publication Critical patent/JPS6238863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify the inspection of characteristics, by eliminating the need for a cutting process of manufacture by separating the outer lead nose portions of a lead frame of a resin mold type semiconductor device from an outer frame and by connecting leads by means of a tie-bar and a support portion. CONSTITUTION:The outer lead nose portions 1 of a lead frame of a resin mold type IC are perfectly isolated from a frame outer frame portion 2. Lead portions are continuously connected by means of a tie-bar 3, and the tie-bar 3 and the frame outer frame portion 2 are connected means of a tie-bar deformed support portion 7. When molding an IC element portion with resin, a resin mold portion 4 and the outer frame are connected by means of a pair of connecting portions 6, 6' mounted to an inner surface of the outer frame. Since each outer lead is also separated mutually and electrically from the frame outer frame portion only by cutting the tie- bar 3 after molding, the electric characteristics of the IC can be inspected continuously and automatically only by contacting a measuring terminal with the leads.
JP13163978A 1978-10-27 1978-10-27 Lead frame Granted JPS5559749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13163978A JPS5559749A (en) 1978-10-27 1978-10-27 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13163978A JPS5559749A (en) 1978-10-27 1978-10-27 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6392887A Division JPS62252959A (en) 1987-03-20 1987-03-20 Lead frame

Publications (2)

Publication Number Publication Date
JPS5559749A true JPS5559749A (en) 1980-05-06
JPS6238863B2 JPS6238863B2 (en) 1987-08-20

Family

ID=15062750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13163978A Granted JPS5559749A (en) 1978-10-27 1978-10-27 Lead frame

Country Status (1)

Country Link
JP (1) JPS5559749A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749129A (en) * 1980-09-09 1982-03-20 Matsushita Electric Ind Co Ltd Method of producing electronic part
JPS5827332A (en) * 1981-08-11 1983-02-18 Toshiba Corp Lead frame and manufacture of semiconductor device employing the same
JPS58154240A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Resin sealed type semiconductor device
JPS58170834U (en) * 1982-05-07 1983-11-15 日本電気株式会社 Lead frame island suspension structure
JPS6155349U (en) * 1984-08-29 1986-04-14
JPS62190858A (en) * 1986-02-18 1987-08-21 Mitsubishi Electric Corp Semiconductor device
JPS62252959A (en) * 1987-03-20 1987-11-04 Hitachi Ltd Lead frame
JPS63147832U (en) * 1987-03-19 1988-09-29
US5869884A (en) * 1996-06-27 1999-02-09 Nec Corporation Semiconductor device having lead terminal on only one side of a package
CN107845575A (en) * 2017-11-03 2018-03-27 浙江人和光伏科技有限公司 A kind of production method of thin slice diode

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105867U (en) * 1989-02-10 1990-08-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0122690B2 (en) * 1980-09-09 1989-04-27 Matsushita Electric Ind Co Ltd
JPS5749129A (en) * 1980-09-09 1982-03-20 Matsushita Electric Ind Co Ltd Method of producing electronic part
JPS5827332A (en) * 1981-08-11 1983-02-18 Toshiba Corp Lead frame and manufacture of semiconductor device employing the same
JPH0131687B2 (en) * 1981-08-11 1989-06-27 Tokyo Shibaura Electric Co
JPS58154240A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Resin sealed type semiconductor device
JPS58170834U (en) * 1982-05-07 1983-11-15 日本電気株式会社 Lead frame island suspension structure
JPS638144Y2 (en) * 1982-05-07 1988-03-10
JPS6155349U (en) * 1984-08-29 1986-04-14
JPS62190858A (en) * 1986-02-18 1987-08-21 Mitsubishi Electric Corp Semiconductor device
JPS63147832U (en) * 1987-03-19 1988-09-29
JPS62252959A (en) * 1987-03-20 1987-11-04 Hitachi Ltd Lead frame
JPH0152905B2 (en) * 1987-03-20 1989-11-10 Hitachi Ltd
US5869884A (en) * 1996-06-27 1999-02-09 Nec Corporation Semiconductor device having lead terminal on only one side of a package
CN107845575A (en) * 2017-11-03 2018-03-27 浙江人和光伏科技有限公司 A kind of production method of thin slice diode

Also Published As

Publication number Publication date
JPS6238863B2 (en) 1987-08-20

Similar Documents

Publication Publication Date Title
IE832368L (en) A plastics moulded semiconductor device
JPS5559749A (en) Lead frame
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
DE2965730D1 (en) Process for manufacturing an insulating structure in a semiconductor body
JPS55128835A (en) Molding method and mold used therefor
BR8800755A (en) ELECTRIC CAPACITOR AND PROCESS FOR ITS MANUFACTURING
JPS5624958A (en) Lead frame for semiconductor device
JPS5380969A (en) Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS57154863A (en) Manufacture of resin sealing type electronic parts
JPS57178352A (en) Manufacture of resin sealing type semiconductor device and lead frame employed thereon
FR2274999A1 (en) PROCESS FOR THE MANUFACTURE OF AN ELECTRICALLY CONDUCTIVE COMPOSITE MATERIAL AND THE COMPOSITE MATERIAL SO OBTAINED
JPS54107261A (en) Production of resin seal-type semiconductor device and lead frame used in this production
JPS55113356A (en) Manufacture of electronic circuit and multilead frame
JPS554984A (en) Resin-sealing metal mold for semiconductor device
JPS5624960A (en) Lead frame for semiconductor device
JPS5642357A (en) Semiconductor device
JPS55163867A (en) Lead frame for semiconductor device
JPS56156989A (en) Semiconductor storage device
JPS5649547A (en) Manufacture of semiconductor device
JPS5232694A (en) Manufacturing method of solid pickup device
JPS5771158A (en) Frame for semiconductor device
JPS52113677A (en) Production of semiconductor device
JPS5696847A (en) Semiconductor device
JPS554987A (en) Lead frame for semiconductor device
JPS55102261A (en) Lead frame