JPS554984A - Resin-sealing metal mold for semiconductor device - Google Patents

Resin-sealing metal mold for semiconductor device

Info

Publication number
JPS554984A
JPS554984A JP7839078A JP7839078A JPS554984A JP S554984 A JPS554984 A JP S554984A JP 7839078 A JP7839078 A JP 7839078A JP 7839078 A JP7839078 A JP 7839078A JP S554984 A JPS554984 A JP S554984A
Authority
JP
Japan
Prior art keywords
resin
lead frame
metal mold
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7839078A
Other languages
Japanese (ja)
Inventor
Toshiyuki Murakami
Nobutaka Nagamine
Ikuo Enokida
Toshiro Arima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP7839078A priority Critical patent/JPS554984A/en
Publication of JPS554984A publication Critical patent/JPS554984A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent shortcircuiting between a fine metal wire and the terminal of an element at the time of sealing, by providing steps at the position of resin-sealing metal molds, to which the leads of a lead frame, supporting semiconductor elements, are connected. CONSTITUTION:Semiconductor element 4 is fixed to semiconductor element fixing unit 1 of a lead frame. Internal lead 3 and the electrode of element 4 is connected by using fine metal wire 5. There are enclosed in upper metal mold 16 and lower metal mold 17 and sealed with resin. In this structure, low steps 18 and 18' and 19 and 19' are provided at the place where metal molds 16 and 17 are brought into contact with internal lead 2 of the lead frame. When the lead frame is provided with these steps, fixing unit 1 and lead 2 are placed lower than other leads so that fine wire 5 is prevented from contact with the terminal of element 4, and thus shortcircuiting is prevented.
JP7839078A 1978-06-27 1978-06-27 Resin-sealing metal mold for semiconductor device Pending JPS554984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7839078A JPS554984A (en) 1978-06-27 1978-06-27 Resin-sealing metal mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7839078A JPS554984A (en) 1978-06-27 1978-06-27 Resin-sealing metal mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS554984A true JPS554984A (en) 1980-01-14

Family

ID=13660679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7839078A Pending JPS554984A (en) 1978-06-27 1978-06-27 Resin-sealing metal mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS554984A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816461U (en) * 1981-07-24 1983-02-01 イ−グル工業株式会社 Stern tube shaft sealing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816461U (en) * 1981-07-24 1983-02-01 イ−グル工業株式会社 Stern tube shaft sealing device

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