JPS554984A - Resin-sealing metal mold for semiconductor device - Google Patents
Resin-sealing metal mold for semiconductor deviceInfo
- Publication number
- JPS554984A JPS554984A JP7839078A JP7839078A JPS554984A JP S554984 A JPS554984 A JP S554984A JP 7839078 A JP7839078 A JP 7839078A JP 7839078 A JP7839078 A JP 7839078A JP S554984 A JPS554984 A JP S554984A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- metal mold
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent shortcircuiting between a fine metal wire and the terminal of an element at the time of sealing, by providing steps at the position of resin-sealing metal molds, to which the leads of a lead frame, supporting semiconductor elements, are connected. CONSTITUTION:Semiconductor element 4 is fixed to semiconductor element fixing unit 1 of a lead frame. Internal lead 3 and the electrode of element 4 is connected by using fine metal wire 5. There are enclosed in upper metal mold 16 and lower metal mold 17 and sealed with resin. In this structure, low steps 18 and 18' and 19 and 19' are provided at the place where metal molds 16 and 17 are brought into contact with internal lead 2 of the lead frame. When the lead frame is provided with these steps, fixing unit 1 and lead 2 are placed lower than other leads so that fine wire 5 is prevented from contact with the terminal of element 4, and thus shortcircuiting is prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7839078A JPS554984A (en) | 1978-06-27 | 1978-06-27 | Resin-sealing metal mold for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7839078A JPS554984A (en) | 1978-06-27 | 1978-06-27 | Resin-sealing metal mold for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS554984A true JPS554984A (en) | 1980-01-14 |
Family
ID=13660679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7839078A Pending JPS554984A (en) | 1978-06-27 | 1978-06-27 | Resin-sealing metal mold for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS554984A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816461U (en) * | 1981-07-24 | 1983-02-01 | イ−グル工業株式会社 | Stern tube shaft sealing device |
-
1978
- 1978-06-27 JP JP7839078A patent/JPS554984A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816461U (en) * | 1981-07-24 | 1983-02-01 | イ−グル工業株式会社 | Stern tube shaft sealing device |
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