JPS5745964A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS5745964A JPS5745964A JP55122052A JP12205280A JPS5745964A JP S5745964 A JPS5745964 A JP S5745964A JP 55122052 A JP55122052 A JP 55122052A JP 12205280 A JP12205280 A JP 12205280A JP S5745964 A JPS5745964 A JP S5745964A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- frame
- integrated circuit
- hybrid integrated
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To reduce by half the connecting portions of a hybrid integrated circuit by forming leads for external terminal of a frame and connecting the leads for the external terminal directly to the electrodes of an IC substrate without using wires nor lead wires. CONSTITUTION:A frame 1 has leads 8 for external terminal, the leads 8 are pressed to be reduced in thickness, are then bent to be brought into the position of the respective electrodes 5 of an IC as a connecting part. The leads 8 are disposed at a frame 1 corresponding to the electrodes 5 of the IC. When the frame 1 is bonded at 3 to a substrate 2, the connecting part 10 of the leads 8 is positioned at the respective electrodes 5, and is thereafter soldered at 6 to complete it. With this configuration, the molten part is reduced by half from the conventional one, and an IC of inexpensive cost and high reliability can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55122052A JPS5745964A (en) | 1980-09-02 | 1980-09-02 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55122052A JPS5745964A (en) | 1980-09-02 | 1980-09-02 | Manufacture of hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5745964A true JPS5745964A (en) | 1982-03-16 |
Family
ID=14826417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55122052A Pending JPS5745964A (en) | 1980-09-02 | 1980-09-02 | Manufacture of hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5745964A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0077276A2 (en) * | 1981-10-13 | 1983-04-20 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Method for fabricating a hybrid circuit module |
-
1980
- 1980-09-02 JP JP55122052A patent/JPS5745964A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0077276A2 (en) * | 1981-10-13 | 1983-04-20 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Method for fabricating a hybrid circuit module |
EP0077276A3 (en) * | 1981-10-13 | 1986-03-26 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Method for fabricating a hybrid circuit module |
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