JPS5687350A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5687350A JPS5687350A JP16426879A JP16426879A JPS5687350A JP S5687350 A JPS5687350 A JP S5687350A JP 16426879 A JP16426879 A JP 16426879A JP 16426879 A JP16426879 A JP 16426879A JP S5687350 A JPS5687350 A JP S5687350A
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminals
- semiconductor device
- small piece
- plural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To miniaturize the semiconductor device by a method wherein a small piece of semiconductor device with plural bonding terminals are provided in an insulating receiving case, and the bonding terminals are connected to the terminals on case side insulating plates. CONSTITUTION:The small piece of semiconductor device 2 is provided in the receiving case 1, plural input terminals 3a, 3b are formed on the device and are connected to the case side terminals 4a, 4b with metal wires 5a, 5b. Accordingly necessary inputs can be connected directly from the case at the necessary points on the device, the number of wirings on the small piece of device can be decreased, the reception in the case is simplified and the device can be miniaturized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16426879A JPS5687350A (en) | 1979-12-18 | 1979-12-18 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16426879A JPS5687350A (en) | 1979-12-18 | 1979-12-18 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5687350A true JPS5687350A (en) | 1981-07-15 |
Family
ID=15789850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16426879A Pending JPS5687350A (en) | 1979-12-18 | 1979-12-18 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687350A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103631A (en) * | 1983-11-11 | 1985-06-07 | Nec Corp | Semiconductor integrated circuit device |
US5473514A (en) * | 1990-12-20 | 1995-12-05 | Kabushiki Kaisha Toshiba | Semiconductor device having an interconnecting circuit board |
-
1979
- 1979-12-18 JP JP16426879A patent/JPS5687350A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103631A (en) * | 1983-11-11 | 1985-06-07 | Nec Corp | Semiconductor integrated circuit device |
JPH0241904B2 (en) * | 1983-11-11 | 1990-09-19 | ||
US5473514A (en) * | 1990-12-20 | 1995-12-05 | Kabushiki Kaisha Toshiba | Semiconductor device having an interconnecting circuit board |
US5646830A (en) * | 1990-12-20 | 1997-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device having an interconnecting circuit board |
US5715147A (en) * | 1990-12-20 | 1998-02-03 | Kabushiki Kaisha Toshiba | Semiconductor device having an interconnecting circuit board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52120768A (en) | Semiconductor device | |
GB1025555A (en) | Improvements in and relating to methods of manufacturing peltier devices | |
JPS5687350A (en) | Semiconductor device | |
JPS542683A (en) | Semiconductor chip | |
JPS5412286A (en) | Semiconductor device | |
JPS5785244A (en) | Semiconductor device | |
JPS5412263A (en) | Semiconductor element and production of the same | |
JPS5357971A (en) | Production of semiconductor device | |
JPS53107259A (en) | Compensator for delay of envelope | |
JPS57211755A (en) | Semiconductor device | |
JPS5789331A (en) | Tuner device | |
JPS5623768A (en) | Semiconductor device | |
JPS55148449A (en) | Semiconductor device | |
GB1017423A (en) | Improvements in semiconductor devices | |
JPS57114277A (en) | Semiconductor device | |
JPS56138932A (en) | Manufacture of semiconductor device | |
JPS57174913A (en) | Characteristic adjusting method for surface acoustic wave device | |
JPS56116646A (en) | Semiconductor device | |
JPS55157254A (en) | Digital-to-analog converter | |
JPS53108372A (en) | Substrate for wireless bonding | |
JPS53136961A (en) | Internal-matched high frequency semiconductor device | |
JPS5335472A (en) | Production of semiconductor unit | |
JPS5763847A (en) | Transistor circut | |
JPS52119075A (en) | Manufacture of semiconductor device | |
JPS5325394A (en) | Se miconductor device |