JPS6411351A - Package for sealing circuit component - Google Patents
Package for sealing circuit componentInfo
- Publication number
- JPS6411351A JPS6411351A JP16685087A JP16685087A JPS6411351A JP S6411351 A JPS6411351 A JP S6411351A JP 16685087 A JP16685087 A JP 16685087A JP 16685087 A JP16685087 A JP 16685087A JP S6411351 A JPS6411351 A JP S6411351A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- package
- plate
- base
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To eliminate the need for connecting earth terminals with silver solder and make a package lighter without using metal frames by using a base wherein the earth terminals are mounted at an electrode plate of a package base and further, by sealing earth and lead terminals, thereby forming a book-type body made of insulating materials around the above base. CONSTITUTION:A base 21 is equipped with a flat plate type electrode plate 22 and a number of earth terminals 5 are extended to the outside and are connected with a plate 24. A lead terminal 3 extends in the direction of the electrode plate 22 from the plate 24 and a pointed end 32 is formed into a sectional U-shape and allows circuit components 30 to be easily connected to the lead terminal 3. The other pointed end 51 of the terminal 5 has the same functions. A book-type body 26 made of insulating materials 4 is formed around the base 21 and it not only seals terminals 5 and 3 but also makes this package form an air-tight space 28 wherein circuit components are sealed. When the package is used, the plate 24 is cut-off from the terminals 5 and 3 so that mutual contact is cut between the above terminals and plate 24 and mounting of the circuit components 30 into the air-tight space 28 allows the circuit components 30 to be connected to the terminals 5 and 3. After that, the package is pressed using pressure after putting a lid 8 on it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16685087A JPS6411351A (en) | 1987-07-06 | 1987-07-06 | Package for sealing circuit component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16685087A JPS6411351A (en) | 1987-07-06 | 1987-07-06 | Package for sealing circuit component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6411351A true JPS6411351A (en) | 1989-01-13 |
Family
ID=15838806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16685087A Pending JPS6411351A (en) | 1987-07-06 | 1987-07-06 | Package for sealing circuit component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6411351A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0515337U (en) * | 1991-07-31 | 1993-02-26 | 株式会社フジ電科 | Airtight terminal |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5148917U (en) * | 1974-10-09 | 1976-04-13 |
-
1987
- 1987-07-06 JP JP16685087A patent/JPS6411351A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5148917U (en) * | 1974-10-09 | 1976-04-13 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0515337U (en) * | 1991-07-31 | 1993-02-26 | 株式会社フジ電科 | Airtight terminal |
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