JPS56165333A - Mounting method for electronic parts - Google Patents

Mounting method for electronic parts

Info

Publication number
JPS56165333A
JPS56165333A JP6939680A JP6939680A JPS56165333A JP S56165333 A JPS56165333 A JP S56165333A JP 6939680 A JP6939680 A JP 6939680A JP 6939680 A JP6939680 A JP 6939680A JP S56165333 A JPS56165333 A JP S56165333A
Authority
JP
Japan
Prior art keywords
pad
conductor wiring
melting point
low melting
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6939680A
Other languages
Japanese (ja)
Other versions
JPS5925378B2 (en
Inventor
Kazufumi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6939680A priority Critical patent/JPS5925378B2/en
Publication of JPS56165333A publication Critical patent/JPS56165333A/en
Publication of JPS5925378B2 publication Critical patent/JPS5925378B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to perform a wireless bonding and a high density mounting by a method wherein the connected section of a conductor wiring and a connecting pad is irradiated by a focussed ray of light, said section is locally heated up and the connected section is fused. CONSTITUTION:A conductor wiring 12 is formed on a glass substrate 11, the metal having a low melting point such as solder, for example, is evaporated and the metal having a low melting point, excluding the section corresponding to an electrode pad 14, is removed by performing an etching. Then, the pad 14 on a semiconductor element 13 and the wiring layer are positioned and tightly fixed through the intermediary of the metal layer 15 having a low melting point. Subsequently, the part facing the pad 14 on the conductor wiring 12 is heated up by irradiating the ray of light A which is focussed by a lens from the side of the glass plate 11, the metal layer having a low melting point is locally fused and the conductor wiring and the pad are connected. Through these procedures, a bonding can be easily performed on the substrate side whereon a conductor wiring has been formed by performing no special processing on the substrate side and without having a positional deviation.
JP6939680A 1980-05-23 1980-05-23 How to mount electronic components Expired JPS5925378B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6939680A JPS5925378B2 (en) 1980-05-23 1980-05-23 How to mount electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6939680A JPS5925378B2 (en) 1980-05-23 1980-05-23 How to mount electronic components

Publications (2)

Publication Number Publication Date
JPS56165333A true JPS56165333A (en) 1981-12-18
JPS5925378B2 JPS5925378B2 (en) 1984-06-16

Family

ID=13401395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6939680A Expired JPS5925378B2 (en) 1980-05-23 1980-05-23 How to mount electronic components

Country Status (1)

Country Link
JP (1) JPS5925378B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188995A (en) * 1983-04-11 1984-10-26 沖電気工業株式会社 Method of solder connecting and inspecting electronic part and circuit board
JPH01161725A (en) * 1987-12-17 1989-06-26 Sony Corp Manufacture of optical device
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
JPH0429338A (en) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Method circuit board for mounting ic and its mounting
JP2006303357A (en) * 2005-04-25 2006-11-02 Ricoh Microelectronics Co Ltd Packaging method of electronic component
JP2012524389A (en) * 2009-04-16 2012-10-11 ショット アクチエンゲゼルシャフト Method for conductively coupling a device on a transparent substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188995A (en) * 1983-04-11 1984-10-26 沖電気工業株式会社 Method of solder connecting and inspecting electronic part and circuit board
JPH01161725A (en) * 1987-12-17 1989-06-26 Sony Corp Manufacture of optical device
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
JPH0429338A (en) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Method circuit board for mounting ic and its mounting
JP2006303357A (en) * 2005-04-25 2006-11-02 Ricoh Microelectronics Co Ltd Packaging method of electronic component
JP2012524389A (en) * 2009-04-16 2012-10-11 ショット アクチエンゲゼルシャフト Method for conductively coupling a device on a transparent substrate

Also Published As

Publication number Publication date
JPS5925378B2 (en) 1984-06-16

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