JPS56155559A - Manufacture of ceramic package - Google Patents

Manufacture of ceramic package

Info

Publication number
JPS56155559A
JPS56155559A JP5880380A JP5880380A JPS56155559A JP S56155559 A JPS56155559 A JP S56155559A JP 5880380 A JP5880380 A JP 5880380A JP 5880380 A JP5880380 A JP 5880380A JP S56155559 A JPS56155559 A JP S56155559A
Authority
JP
Japan
Prior art keywords
leads
tips
pads
external leads
silver solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5880380A
Other languages
Japanese (ja)
Other versions
JPH02858B2 (en
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5880380A priority Critical patent/JPS56155559A/en
Publication of JPS56155559A publication Critical patent/JPS56155559A/en
Publication of JPH02858B2 publication Critical patent/JPH02858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the deformation and the poor soldering of external leads by temporarily pressure welding by heating a solder material to the fixed position of the tips of external leads wherein the external leads are soldered to pads for installing the leads of a multilayer ceramic substrate. CONSTITUTION:Silver solder ribbons 5 are set in the groove 13 of a carbon jig 12 and lead plates 7 are engaged with guide pins 8 for positioning and a predetermined weight 10 is placed through carbon frames 9 and heat is applied under a reducing atmosphere to pressure weld the silver solder ribbons 5 by heating to the tips of external leads 6. Next, the pads 1 of a ceramic substrate 2 are placed in the groove 4 of a carbon jig 3 and directed to upward. The lead plates 7 with the silver solder ribbons are set on the basis of guide pins 8 to match the pads 1 with the tips of the leads 6. The weight 10 is placed to heat under the reducing atmosphere and the tips of the leads 6 are soldered 5' on the pads. Finally, the leads 6 are cut at a predetermined position. In this composition, workability is good and a yield is also improved.
JP5880380A 1980-05-02 1980-05-02 Manufacture of ceramic package Granted JPS56155559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5880380A JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5880380A JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Publications (2)

Publication Number Publication Date
JPS56155559A true JPS56155559A (en) 1981-12-01
JPH02858B2 JPH02858B2 (en) 1990-01-09

Family

ID=13094747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5880380A Granted JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Country Status (1)

Country Link
JP (1) JPS56155559A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624463A (en) * 2013-11-29 2014-03-12 中国电子科技集团公司第四十七研究所 FP-type ceramic tube-shell parallel seam welding packaging clamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624463A (en) * 2013-11-29 2014-03-12 中国电子科技集团公司第四十七研究所 FP-type ceramic tube-shell parallel seam welding packaging clamp

Also Published As

Publication number Publication date
JPH02858B2 (en) 1990-01-09

Similar Documents

Publication Publication Date Title
JPS56155559A (en) Manufacture of ceramic package
JPS6481330A (en) Film carrier semiconductor device
JPS5596662A (en) Electronic component member
JPS6423543A (en) Soldering by use of laser
GB2018036A (en) Precision resistors, sub-assemblies therefor for their manufacture
JPS5791548A (en) Manufacture of hybrid integrated circuit
JPS57111054A (en) Semiconductor device
JPS55121655A (en) Manufacture of semiconductor device
JPS5640267A (en) Pretinning method for flat lead
JPS5636146A (en) Manufacture of clad material
JPS55134951A (en) Semiconductor device
JPS568851A (en) Lead wire connecting method of semiconductor device
JPS62134173A (en) Laser die bonding tool
JPS5656656A (en) Container for semiconductor device
JPS5745939A (en) Semiconductor device
JPS56146243A (en) Bonding method
JPS5619627A (en) Assembly of semiconductor device
JPS5748241A (en) Bonding method for chip
JPS56112736A (en) Semiconductor assembling apparatus
JPS57197843A (en) Lead pin for integrated circuit device
JPS57192057A (en) Semiconductor device
JPS56114338A (en) Semiconductor device
JPS5656645A (en) Assembling method for semiconductor device
JPS54146961A (en) Production of semiconductor device
JPH0462853A (en) Package for semiconductor device