JPS5636146A - Manufacture of clad material - Google Patents

Manufacture of clad material

Info

Publication number
JPS5636146A
JPS5636146A JP11046279A JP11046279A JPS5636146A JP S5636146 A JPS5636146 A JP S5636146A JP 11046279 A JP11046279 A JP 11046279A JP 11046279 A JP11046279 A JP 11046279A JP S5636146 A JPS5636146 A JP S5636146A
Authority
JP
Japan
Prior art keywords
lead frame
annealed
rolled
clad material
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11046279A
Other languages
Japanese (ja)
Other versions
JPS6024585B2 (en
Inventor
Teruo Watanabe
Norihiko Yamada
Fumio Iwane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP11046279A priority Critical patent/JPS6024585B2/en
Publication of JPS5636146A publication Critical patent/JPS5636146A/en
Publication of JPS6024585B2 publication Critical patent/JPS6024585B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the faulty swelling of a clad material for a lead frame and obtain high yield by a method wherein a brazing material of Ag or an Ag alloy is rolled and pressure-welded on an IC lead frame substrate, and annealed at a specified temperature. CONSTITUTION:The brazing material 11 of Ag or an Ag alloy is rolled and pressure-welded on the IC lead frame substrate 10, and annealed at a temperature not more than 500 deg.C. For example, the IC lead frame substrate 21 in 42Ni and a brazing material sheet 20 in an Ag-Cu alloy are rolled and pressure-welded by means of a device shown in the figure at the normal temperature and at 30% rolling rate, and diffused and annealed at 400 deg.C, and the clad material is obtained.
JP11046279A 1979-08-31 1979-08-31 Manufacturing method of cladding material Expired JPS6024585B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11046279A JPS6024585B2 (en) 1979-08-31 1979-08-31 Manufacturing method of cladding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11046279A JPS6024585B2 (en) 1979-08-31 1979-08-31 Manufacturing method of cladding material

Publications (2)

Publication Number Publication Date
JPS5636146A true JPS5636146A (en) 1981-04-09
JPS6024585B2 JPS6024585B2 (en) 1985-06-13

Family

ID=14536317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11046279A Expired JPS6024585B2 (en) 1979-08-31 1979-08-31 Manufacturing method of cladding material

Country Status (1)

Country Link
JP (1) JPS6024585B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105551A (en) * 1981-11-20 1983-06-23 Fujitsu Ltd Semiconductor device
JPS58156565A (en) * 1982-03-11 1983-09-17 河原工業株式会社 Pavement material comprising volcanic ash as main component
JPH0668501U (en) * 1993-03-11 1994-09-27 聚上企業股▲ひん▼有限公司 Slippers with anti-slip and toe guard functions

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6372088U (en) * 1987-07-17 1988-05-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105551A (en) * 1981-11-20 1983-06-23 Fujitsu Ltd Semiconductor device
JPS58156565A (en) * 1982-03-11 1983-09-17 河原工業株式会社 Pavement material comprising volcanic ash as main component
JPH0668501U (en) * 1993-03-11 1994-09-27 聚上企業股▲ひん▼有限公司 Slippers with anti-slip and toe guard functions

Also Published As

Publication number Publication date
JPS6024585B2 (en) 1985-06-13

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