JPS62134173A - Laser die bonding tool - Google Patents

Abstract

PURPOSE:To instantaneously laser bond a semiconductor element by shielding laser light which is led to an optical fiber, and also providing a vacuum adsorbing means on a supporting body of the optical fiber, or the like. CONSTITUTION:An exhaust is executed from an exhaust port 122 of the first supporting body 21, and a semiconductor element 1 is sucked to a vacuum sucking nozzle 120 through an exhaust hole 123. Subsequently, a laser die bonding tool is made to descend and the semiconductor element 1 and a heat sink 2 are made to contact through solder 104. When a load which has been set to a load regulator is applied to the semiconductor element 1, a shielding plate 125 contacts the solder 104. At this point, when a laser light is emitted through an optical fiber wire 61, the solder 104 of the heat sink 2 is melted. When the laser light is stopped, the solder 104 is solidified, and the semiconductor element 1 does not strike directly against the laser light but is fixed to the heat sink 2 by the solder 104. According to this mechanism, the bonding time can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is mainly concerned with the production of semiconductor devices using laser light as a heat source without unnecessarily heating the pond portion of the semiconductor device.
It is intended for instantaneous bonding and is used for assembling semiconductor devices and the like.

2. Description of the Related Art Die bonding technology is essential in the assembly process of semiconductor devices, and currently the mainstream method is to use a vacuum suction nozzle and a heater.

The conventional technique will be explained below using FIG. 2. In FIG. 2, a semiconductor element 1 is adsorbed by a vacuum suction nozzle 120 onto a heat sink 2 attached to a metal substrate 3, and soldered with a solder 10.
The semiconductor element 1 is fixed to the heat sink 2 by the solder 104 being melted and solidified by being brought into contact with each other after positioning through the heat sink 4 and heated by the heater 140, and then cooled.

Problems to be Solved by the Invention However, in such a configuration, the time required for raising and lowering the temperature for bonding the semiconductor element is relatively long, resulting in a large loss and at the same time hindering the high efficiency of the work. Furthermore, a semiconductor device consisting of a plurality of different parts has the problem of requiring special care, such as using solder materials with different melting points for each part.

The present invention aims to solve the above problems by instantaneously bonding semiconductor elements using laser light as a heat source.

Means for solving the gap between the first support body, which includes an exhaust port for inserting and fixing a capillary for fixing an optical fiber that guides a laser beam, an exhaust port, a nozzle guide, and a shielding plate, and a shape that passes through the exhaust port and the nozzle guide. The device is equipped with a vacuum suction nozzle that can be attached with a vacuum suction nozzle, a load adjuster for the vacuum suction nozzle, and a protective case for the optical fiber, and is configured to perform bonding using laser light as a heat source.

According to the present invention having the above configuration, the laser beam emitted from the optical fiber does not directly irradiate the semiconductor element due to the effect of the shielding plate, and only instantaneously irradiates the solder on the heat sink. Bonding of semiconductor elements can be completed in a short time without excessive heating.

Example An embodiment of the present invention will be described below based on the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention.

In FIG. 1, the optical fiber 61 inserted into the capillary 66 is fixed to the first support body 21 having a nozzle guide 124 and an exhaust port 122, and then a protective case 81 is attached. Furthermore, the first support body 21 has an exhaust hole 123 that passes through the nozzle guide 124 and the exhaust port 122.
A vacuum suction nozzle 120 equipped with a vacuum suction nozzle 120 is inserted, and a load adjuster 150 is attached above the vacuum suction nozzle 120.

The operation of the above configuration will be explained below.

By exhausting air from the exhaust port 122, the semiconductor element 1 is sucked into the vacuum suction nozzle 120 through the exhaust hole 123. After aligning with the heat sink 2 having the solder 104 fixed to the metal substrate 3 in the above-described state, the semiconductor element 1 and the heat sink 2 are brought into contact via the solder 104 by slowly lowering the laser die bonding tool. As the descent continues, the load set by the load adjuster 150 is applied to the semiconductor element 1, and at the same time, the portion of the laser die bonding tool excluding the vacuum suction nozzle 12Q and the load adjuster 150 continues to descend, and the shielding plate 125 becomes a heat sink. It contacts the solder 104 of No. 2. At the point where the shielding plate 125 comes into contact with the solder 104 of the heat sink 2, the laser die bonding sole completely stops descending and emits a laser beam, which melts the solder 104 of the heat sink 2. By stopping the emission of the laser beam, the solder 104 melts. solidify. Therefore, the semiconductor element 1 is fixed to the heat tank 2 with the solder 104 without being directly exposed to the laser beam.

In this embodiment, a YAG laser is used as the laser, but other lasers (for example, CO2) may be used. Also, although Pb-8n type solder was used, other types (e.g., Au alloy type) were used.
But it doesn't matter.

Effects of the Invention As described above, by using the laser die bonding tool of the present invention, it is possible to instantaneously bond semiconductor elements without unnecessarily heating other parts of the semiconductor device, thereby improving the method of assembling a semiconductor laser. This has great effects, such as increasing the degree of freedom and shortening the bonding time.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a laser die bonding tool according to an embodiment of the present invention, and FIG. 2 is a configuration diagram of a conventional bonding technique. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Heat sink, 3... Metal substrate, 21... First support body, 61... Optical fiber Bare wire, 62...
...Optical fiber core, 66...Capillary, 8
1...Protective case, 104...Solder,
120... Vacuum suction nozzle, 122...
・Exhaust port, 123...Exhaust hole, 124...
・-Nozzle guide, 126... Shielding plate, 15
0...Load adjuster.

Claims (1)

[Claims] a first support body comprising an optical fiber that guides a laser beam, a capillary that fixes the optical fiber, an exhaust port that inserts and fixes the capillary, a nozzle guide, and a shielding plate; an exhaust port of the first support body; Laser die bonding, characterized in that it comprises a vacuum suction nozzle that is attached to pass through a nozzle guide, a load adjuster for the vacuum suction nozzle, and a protective case for the optical fiber, and that bonding is performed using laser light as a heat source. tool.