JPS5572068A - Lead parts and package of the same - Google Patents

Lead parts and package of the same

Info

Publication number
JPS5572068A
JPS5572068A JP14622978A JP14622978A JPS5572068A JP S5572068 A JPS5572068 A JP S5572068A JP 14622978 A JP14622978 A JP 14622978A JP 14622978 A JP14622978 A JP 14622978A JP S5572068 A JPS5572068 A JP S5572068A
Authority
JP
Japan
Prior art keywords
lead
package
circuit plate
insulation material
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14622978A
Other languages
Japanese (ja)
Inventor
Masao Sonoda
Toshihiro Sakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14622978A priority Critical patent/JPS5572068A/en
Publication of JPS5572068A publication Critical patent/JPS5572068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To accomplish accurate positioning while preventing deformation in the mounting of the circuit plate by inducting the lead drawn from a package to the joining position being regulated with an insulation material when the package is fixed on the circuit plate.
CONSTITUTION: A package 3 is mounted to a part package mount section of a lead frame 1 comprising a lead 2 and a tie bar section 1a and then, the tie bar section 1a is cut off. Prior to the cutting, the lead 2 is positioned outward from the joining section for the mounting to the circuit plate inside the cutting portion and fastened with an insulation material 4 comprising a mold or an adhesive tape. Thereafter, the lead thus fastened is bent in a given shape and a notch 5 is given to facilitate the removal of the portion to be covered with the insulation material 4 later. The frame thus arranged is placed on the circuit plate 6 and the bottom part 2a of the lead 2 is soldered on the pattern 7 provided on the circuit plate 6. The insulation material is bent and cut off.
COPYRIGHT: (C)1980,JPO&Japio
JP14622978A 1978-11-27 1978-11-27 Lead parts and package of the same Pending JPS5572068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14622978A JPS5572068A (en) 1978-11-27 1978-11-27 Lead parts and package of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14622978A JPS5572068A (en) 1978-11-27 1978-11-27 Lead parts and package of the same

Publications (1)

Publication Number Publication Date
JPS5572068A true JPS5572068A (en) 1980-05-30

Family

ID=15403018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14622978A Pending JPS5572068A (en) 1978-11-27 1978-11-27 Lead parts and package of the same

Country Status (1)

Country Link
JP (1) JPS5572068A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203561U (en) * 1981-06-22 1982-12-24
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
JPS59182944U (en) * 1983-05-20 1984-12-06 クラリオン株式会社 semiconductor equipment
JPS6098651A (en) * 1983-10-19 1985-06-01 トーマス　アンド　ベツツ　コーポレーシヨン Lead member and its mounting method
JPS6271253A (en) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン Semiconductor chip package structure, its test and facilitating method for mounting on substrate
JPS6298759A (en) * 1985-10-25 1987-05-08 Mitsubishi Electric Corp Electronic device
JPS62266856A (en) * 1986-05-15 1987-11-19 Oki Electric Ind Co Ltd Manufacture of hybrid ic
JPS6418750U (en) * 1987-07-22 1989-01-30

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203561U (en) * 1981-06-22 1982-12-24
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
JPS59182944U (en) * 1983-05-20 1984-12-06 クラリオン株式会社 semiconductor equipment
JPS6334289Y2 (en) * 1983-05-20 1988-09-12
JPS6098651A (en) * 1983-10-19 1985-06-01 トーマス　アンド　ベツツ　コーポレーシヨン Lead member and its mounting method
JPH0151064B2 (en) * 1983-10-19 1989-11-01 Thomas & Betts Corp
JPS6271253A (en) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン Semiconductor chip package structure, its test and facilitating method for mounting on substrate
JPS6298759A (en) * 1985-10-25 1987-05-08 Mitsubishi Electric Corp Electronic device
JPS62266856A (en) * 1986-05-15 1987-11-19 Oki Electric Ind Co Ltd Manufacture of hybrid ic
JPS6418750U (en) * 1987-07-22 1989-01-30

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