JPS6418750U - - Google Patents
Info
- Publication number
- JPS6418750U JPS6418750U JP11291287U JP11291287U JPS6418750U JP S6418750 U JPS6418750 U JP S6418750U JP 11291287 U JP11291287 U JP 11291287U JP 11291287 U JP11291287 U JP 11291287U JP S6418750 U JPS6418750 U JP S6418750U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- forming part
- flat
- element body
- cut line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａとｂは本考案の一実施例を示す斜視図
と部分拡大図、第２図ａとｂは本考案の他の実施
例を示す斜視図と部分拡大図、第３図ａとｂは従
来のフラツトリードの構造を示す斜視図と部分拡
大図である。
図中、１はリード形成部、２はフレーム形成部
、５は切欠部（断面積縮小構造）、６は貫通穴（
断面積縮小構造）、７は切断面、８は半田メツキ
、１０はフラツトリード、１５はリード形成面、
２０は素子本体、Ｌはカツトライン、をそれぞれ
示す。
Figures 1a and b are perspective views and partially enlarged views showing one embodiment of the present invention; Figures 2a and b are perspective views and partially enlarged views showing other embodiments of the present invention; Figures 3a and 3b are perspective views and partially enlarged views showing another embodiment of the present invention; b is a perspective view and a partially enlarged view showing the structure of a conventional flat lead. In the figure, 1 is a lead forming part, 2 is a frame forming part, 5 is a notch (cross-sectional area reduced structure), and 6 is a through hole (
7 is a cut surface, 8 is solder plating, 10 is a flat lead, 15 is a lead forming surface,
20 indicates the element body, and L indicates the cut line.
Claims (1)
定されたカツトラインＬ上で切除されるフレーム
形成部２と、前記素子本体２０に固定されたリー
ド形成部１とより成るフラツトリード１０であつ
て、該フラツトリード１０は、前記リード形成部
１とフレーム形成部２との境界である前記カツト
ラインＬ上に、各リード形成部１の断面積を部分
的に縮小させる切欠部５を有してなることを特徴
とするフラツトリード。 A flat lead 10 comprising a frame forming part 2 cut out on a cut line L set parallel to a lead forming surface 15 of an element body 20, and a lead forming part 1 fixed to the element body 20. The flat lead 10 is characterized by having a notch 5 on the cut line L, which is the boundary between the lead forming part 1 and the frame forming part 2, to partially reduce the cross-sectional area of each lead forming part 1. flat lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11291287U JPS6418750U (en) | 1987-07-22 | 1987-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11291287U JPS6418750U (en) | 1987-07-22 | 1987-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418750U true JPS6418750U (en) | 1989-01-30 |
Family
ID=31352282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11291287U Pending JPS6418750U (en) | 1987-07-22 | 1987-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418750U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5572068A (en) * | 1978-11-27 | 1980-05-30 | Fujitsu Ltd | Lead parts and package of the same |
| JPS5815263A (en) * | 1981-07-20 | 1983-01-28 | Matsushita Electric Ind Co Ltd | Semiconductor device |
-
1987
- 1987-07-22 JP JP11291287U patent/JPS6418750U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5572068A (en) * | 1978-11-27 | 1980-05-30 | Fujitsu Ltd | Lead parts and package of the same |
| JPS5815263A (en) * | 1981-07-20 | 1983-01-28 | Matsushita Electric Ind Co Ltd | Semiconductor device |