JPH0252450U - - Google Patents
Info
- Publication number
- JPH0252450U JPH0252450U JP13081088U JP13081088U JPH0252450U JP H0252450 U JPH0252450 U JP H0252450U JP 13081088 U JP13081088 U JP 13081088U JP 13081088 U JP13081088 U JP 13081088U JP H0252450 U JPH0252450 U JP H0252450U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの位置認識部
分拡大図、第２図は本考案の他の実施例を示すリ
ードフレームの位置認識部分拡大図、第３図は従
来方式のリードフレーム上面図である。
１……リードフレーム、２……位置認識部分、
３……ダイパツド、４……インナーリード、５…
…メツキエリア（枠内）、６……つりピン、７…
…メツキ無しエリア、８……穴。
Figure 1 is an enlarged view of a position recognition part of a lead frame according to the present invention, Figure 2 is an enlarged view of a position recognition part of a lead frame showing another embodiment of the present invention, and Figure 3 is a top view of a conventional lead frame. be. 1...Lead frame, 2...Position recognition part,
3...Die pad, 4...Inner lead, 5...
...Metsuki area (within the frame), 6...Hanging pin, 7...
...No plating area, 8...holes.
Claims (1)
たことを特徴とするリードフレーム。 A lead frame characterized by having a non-plated area where no plating is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13081088U JPH0252450U (en) | 1988-10-05 | 1988-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13081088U JPH0252450U (en) | 1988-10-05 | 1988-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252450U true JPH0252450U (en) | 1990-04-16 |
Family
ID=31386311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13081088U Pending JPH0252450U (en) | 1988-10-05 | 1988-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252450U (en) |
-
1988
- 1988-10-05 JP JP13081088U patent/JPH0252450U/ja active Pending