JPS5815263A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the damage of a circuit element chip associated in a package by the influence of static electricity when the static electricity is applied to the lead terminal of the package. CONSTITUTION:The end of a lead terminal 4 is formed in a structure having a shortcircuit lead 8 at one end of a shortcircuit plate 7. The coupler 9 of the terminal 4 to the plate 7 is formed in a shape such as wedge or conical shape at the end of the terminal 4, and is constructed locally in an ultrafine coupling structure with the plate 7. Accordingly, when several bending forces are applied to the plate 7, the coupler 9 can be simply and readily broken, and the plate 7 and the terminal 8 can be separated. In this manner, since all the lead terminals are connected immediately before use, even if static electricity is applied to the lead terminal during the stock or transportation, all the leads becomes the same voltage. Thus, an accident of damaging the circuit element chip due to the production of potential difference at the chip can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and in particular, when static electricity is applied to the lead terminals of a package, a circuit element chip incorporated inside the package is damaged due to the influence of the static electricity. This relates to the structure of the lead terminal that prevents this from occurring.

When a potential difference occurs within a circuit element chip (hereinafter simply referred to as a chip) such as an IC or LSI, especially a MOS type chip, the function of the chip may be damaged or destroyed by the potential difference.

Many of the potential differences that damage and destroy chips occur during storage,
This is due to static electricity generated during transportation or handling, and the functionality of the chip is often destroyed due to the static electricity creating a potential difference within the chip through the lead terminals. Various measures have been taken to prevent this, such as storing and transporting lead terminals by inserting them into conductive sponges, using special carriers made of conductive material (metal, etc.), or using special lead terminal girdles. A method has been adopted to prevent the generation of a potential difference between one end of the chip and the other end of the chip, that is, within the chip, using specially designed jigs and devices.

Similar to the above conventional example, the purpose of the present invention is to prevent damage caused by potential differences within the chip due to the influence of static electricity, but unlike the above conventional example, lead terminals do not require special jigs or equipment. The present invention provides a semiconductor device having a good structure.

First, the configuration of a conventional semiconductor device package will be described below.

The following explanation will be given using a resin-sealed package as an example. FIG. 1 shows the general shape of a conventional lead frame for a sealed package. After adhering the semiconductor chip to the dub 1 and performing predetermined wiring with lead wires to the leads 2, resin sealing 3 is applied.After resin sealing, as shown in FIG.
After removing the outer frame of the lead frame and the retaining plate 6, leaving only the lead terminals 4, the lead terminals 4 are bent to form a finished product as shown in FIG.

The above is the manufacturing method and structure of a conventional general semiconductor device package.

However, such conventional semiconductor devices require specially devised jigs and devices to prevent them from being destroyed by static electricity, as described above.

The present invention provides a semiconductor device that can prevent damage caused by static electricity without requiring special jigs or equipment, and the present invention will be described in detail below.

(Example 1) As shown in FIG. 4, the structure of the lead frame in the semiconductor device of this example is as shown in FIG. It has a structure with The connecting portion 9 between the lead terminal 4 and the shorting plate 7 is as shown in FIGS.
(enlarged view), the tip of the IJ-domain terminal 4 has a wedge-like or cone-like shape, and has a locally fine bonding structure with the shorting plate 7. 7I has a structure in which the connecting portion 9 can be simply and easily broken by applying a bending force, and the shorting plate 7 and the lead terminal 8 can be separated.

- A lead frame with a J2 structure, a normal JJ
After assembling the circuit element chip by the method and applying resin sealing 3, cutting and removing the shaded portion shown in FIG.
The lead terminals 4 and 4' on one side are connected between adjacent lead terminals or connected to each other by a shorting plate 7, forming an oval-shaped lead terminal.

After that, the lead terminals 4, 4' are bent at a predetermined angle (approximately 90 degrees) as shown in FIG.
If the short-circuiting leads 8, 8' are bent to the approximately angle with respect to the short-circuiting plate 7, the short-circuiting leads 8, 8' will be bent due to the elasticity of the shorting leads 8, 8' themselves.
The tip 9 of the lead terminal remains in contact with the redoubt, and all the lead terminals have an electrically equal potential, and even if static electricity is applied to any lead terminal, a large potential difference will occur between the lead terminals. can be prevented.

In the above example, the connection between the left and right lead terminals of the package was explained using the elasticity of the short-circuited leads. However, if it is necessary to maintain an even stronger connection, the short-circuited leads The contact point of the 8° 8' tip 9 may be fixed by any of the six methods such as welding, soldering, etc.

If a semiconductor device having the lead terminal structure as described above is used, all the lead terminals are connected until just before use, so even if static electricity is applied to the lead terminals during storage and transportation, all the lead terminals will have the same potential. Therefore, an accident in which a potential difference occurs in the circuit element chip and causes damage to the circuit element chip is prevented.

The semiconductor device is used by applying bending force several times to the shorting plates 7 and 7' provided at the tips of the lead terminals immediately before use, and as described above, the wedge-shaped or cone-shaped coupling portion 9 is formed. easily breaks, and each lead terminal becomes an independent lead terminal.
It can be said that there are almost no January problems when using it.

(Example 2) In Example 1, the shape of the lead frame was explained using a resin-sealed type (cage).
Basically, they have the same structure and the same effects can be obtained.

FIG. 7 is a plan view of the ceramic package immediately after the semiconductor pellet is assembled, and the tip of the lead terminal 41° is
As in Embodiment 1, as shown in FIG. 6, it has a wedge-like or cone-like shape and is locally connected to the shorting plates 71° and 71', and when the shorting plate is bent several times, Easily short circuit plate 71.
71' is the IJ-)" m-shaped member 41. The structure is broken and separated from 41'.

FIG. 8 is a front view of the cage after the lead terminals 41 and 41' of FIG. 7 are bent at a predetermined angle.

Shorting plate 71.71' connected to lead terminal 41.41'
When the short-circuit leads 81.81' attached to the short-circuit leads 81.81' are bent approximately at right angles to the lead terminals as shown in the figure, the short-circuit leads 81.81' become short-circuit leads 81.
81' is the lower part of the package, and due to the elasticity of the shorting leads themselves, the shorting leads 81 and 81' are brought into pressure contact with each other, and all the lead terminals of the package are electrically connected.

Note that if the short-circuiting leads 81, 81' are fixed by a method such as welding as in the first embodiment, the fixed portion becomes strong.

Further, the method of using the semiconductor device is the same as in the first embodiment.

As described above, if the semiconductor device of the present invention is used, all the lead terminals are connected with good conductors, and even if static electricity is applied to the lead terminals, it is possible to prevent the potential difference from occurring in the semiconductor pellet inside the package. This makes it easy to protect semiconductor pellets from electrostatic damage.

[Brief explanation of drawings]

1 and 2 are plan views of a lead frame of a conventional semiconductor device, FIG. 3 is a perspective view of a conventional resin-sealed semiconductor device package, and FIG. 4 is a semiconductor device according to an embodiment of the present invention. 5 is an enlarged perspective view of the main parts of the lead frame, FIG. 6 is a front view of a semiconductor device according to an embodiment of the present invention using the same lead frame, and FIG. 7 is a diagram of the present invention. 3 of the semiconductor device in other embodiments of the invention
The V-plane view and FIG. 8 are front views of the semiconductor device. ,
3.31 ・・・・・・Cage body, 4.4',
41゜41/...Lead terminal, 6...
Lead frame outer frame, 7, 7', 71, 71'・
...Short circuit plate, 8.8'. 81.81'...Short lead. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure $211 113 Figure 114 Figure 115 Figure 6 Figure 7 Figure 8

Claims (1)

[Claims] An electrode lead terminal having a tapered tip, and a shorting plate locally coupled to the tip of the electrode lead terminal to electrically connect the electrode lead terminals to each other, the shorting plate being cut from the electrode lead terminal. A semiconductor device characterized by having a removable lead frame.