JPS6412509A - Surface packaging device - Google Patents

Surface packaging device

Info

Publication number
JPS6412509A
JPS6412509A JP62169088A JP16908887A JPS6412509A JP S6412509 A JPS6412509 A JP S6412509A JP 62169088 A JP62169088 A JP 62169088A JP 16908887 A JP16908887 A JP 16908887A JP S6412509 A JPS6412509 A JP S6412509A
Authority
JP
Japan
Prior art keywords
terminals
package
side part
zigzags
conducted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62169088A
Other languages
Japanese (ja)
Inventor
Yoshihiko Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62169088A priority Critical patent/JPS6412509A/en
Publication of JPS6412509A publication Critical patent/JPS6412509A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To narrow the gap between terminals as well as to prevent the generation of a solder bridge when a packaging operation is conducted on a printed substrate by a method wherein, when a plurality of lead terminals protrude in parallel from the side part of a package, the flat part of the terminal is shifted alternately in the inside and the outside positions along the side part of the package. CONSTITUTION:A rectangular package 11, formed by molding resin and the like end constituting a device 10, is placed on a printed substrate 20, and when a plurality of lead terminals 12 projecting from the side face 11a of the package 11, the following procedures are taken. The terminal 12 is divided into a plurality of terminals, these flat parts 12a to be used to connect said terminals are positioned at both side parts 11a and the bottom face 11b, and they are alternately positioned separately in zigzags against the straight line S along the side part 11a. Accordingly, the tip part of the terminals 12 goes in and comes out in zigzags, and no sheet-circuit due to soldering is generated when a soldering work is conducted.
JP62169088A 1987-07-06 1987-07-06 Surface packaging device Pending JPS6412509A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62169088A JPS6412509A (en) 1987-07-06 1987-07-06 Surface packaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62169088A JPS6412509A (en) 1987-07-06 1987-07-06 Surface packaging device

Publications (1)

Publication Number Publication Date
JPS6412509A true JPS6412509A (en) 1989-01-17

Family

ID=15880105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62169088A Pending JPS6412509A (en) 1987-07-06 1987-07-06 Surface packaging device

Country Status (1)

Country Link
JP (1) JPS6412509A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116931A1 (en) * 2020-12-03 2022-06-09 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Surface-encapsulated capacitor and method for manufacturing a surface-encapsulated capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116931A1 (en) * 2020-12-03 2022-06-09 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Surface-encapsulated capacitor and method for manufacturing a surface-encapsulated capacitor

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