JPS57181149A - Electronic part and mounting therefor - Google Patents

Electronic part and mounting therefor

Info

Publication number
JPS57181149A
JPS57181149A JP6646881A JP6646881A JPS57181149A JP S57181149 A JPS57181149 A JP S57181149A JP 6646881 A JP6646881 A JP 6646881A JP 6646881 A JP6646881 A JP 6646881A JP S57181149 A JPS57181149 A JP S57181149A
Authority
JP
Japan
Prior art keywords
leads
straight
many
electronic part
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6646881A
Other languages
Japanese (ja)
Other versions
JPS6251502B2 (en
Inventor
Toshihiro Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6646881A priority Critical patent/JPS57181149A/en
Publication of JPS57181149A publication Critical patent/JPS57181149A/en
Publication of JPS6251502B2 publication Critical patent/JPS6251502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To improve the efficiency of soldering work by a method wherein a plurality of leads selected from many leads in a flat package-type electronic parts are used as straight leads and the tip sections of the other leads are formed in U shape. CONSTITUTION:A plurality of leads 2a selected from many leads 2 in a flat package-type electronic part having a mold section 1 are used as straight leads and the tips of the other leads 2b are formed in U shape. Then, the straight leads and U-shaped leads are soldered by melting solder going up from through holes under the condition that the straight leads 2a are penetrated the through holes of a printed substrate for positioning. In this way, soldering for parts with many pins are facilitated under the mixed loading condition with other individual parts and working efficiency is improved.
JP6646881A 1981-05-01 1981-05-01 Electronic part and mounting therefor Granted JPS57181149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6646881A JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6646881A JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Publications (2)

Publication Number Publication Date
JPS57181149A true JPS57181149A (en) 1982-11-08
JPS6251502B2 JPS6251502B2 (en) 1987-10-30

Family

ID=13316640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6646881A Granted JPS57181149A (en) 1981-05-01 1981-05-01 Electronic part and mounting therefor

Country Status (1)

Country Link
JP (1) JPS57181149A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215846A (en) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd Pin grid array
US5055912A (en) * 1990-05-18 1991-10-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS54184069U (en) * 1978-06-16 1979-12-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS54184069U (en) * 1978-06-16 1979-12-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215846A (en) * 1985-07-12 1987-01-24 Matsushita Electric Works Ltd Pin grid array
US5055912A (en) * 1990-05-18 1991-10-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS6251502B2 (en) 1987-10-30

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