JPS6444264A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS6444264A JPS6444264A JP19831287A JP19831287A JPS6444264A JP S6444264 A JPS6444264 A JP S6444264A JP 19831287 A JP19831287 A JP 19831287A JP 19831287 A JP19831287 A JP 19831287A JP S6444264 A JPS6444264 A JP S6444264A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- org
- solvent
- solder
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To improve the workability in soldering by providing a nozzle feeding a pressurized air and opening it in opposition to the through hole for an electronic part of one part of the above of a printed circuit board as well. CONSTITUTION:The frame 12 holding a printed circuit board 3 freely detachably at both ends is provided and a nozzle 13 is arranged as well freely liftably to the upper part of the board 3. The electronic part 4 washable by an org. solvent is inserted into a through hole 5 and when the board 3 removing the oxidized film is carried in, the frame 12 is dipped in a solder 2. The nozzle 13 is then descended and a pressurized air is injected from a tip part 13b to blow off the solder 2 flowed in the through hole 6 of the electronic part unwashable by the org. solvent. The solder clogging of the through hole 6 is thus prevented and the soldering work of the part unwashable by the org. solvent is facilitated and simplified. Consequently the soldering workability is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19831287A JPS6444264A (en) | 1987-08-10 | 1987-08-10 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19831287A JPS6444264A (en) | 1987-08-10 | 1987-08-10 | Soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444264A true JPS6444264A (en) | 1989-02-16 |
Family
ID=16389032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19831287A Pending JPS6444264A (en) | 1987-08-10 | 1987-08-10 | Soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444264A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298463A (en) * | 1991-08-30 | 1994-03-29 | Micron Technology, Inc. | Method of processing a semiconductor wafer using a contact etch stop |
CN111702282A (en) * | 2020-07-13 | 2020-09-25 | 迈普通信技术股份有限公司 | Through hole element unsoldering device, system and method |
-
1987
- 1987-08-10 JP JP19831287A patent/JPS6444264A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298463A (en) * | 1991-08-30 | 1994-03-29 | Micron Technology, Inc. | Method of processing a semiconductor wafer using a contact etch stop |
CN111702282A (en) * | 2020-07-13 | 2020-09-25 | 迈普通信技术股份有限公司 | Through hole element unsoldering device, system and method |
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