JPS6444264A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS6444264A
JPS6444264A JP19831287A JP19831287A JPS6444264A JP S6444264 A JPS6444264 A JP S6444264A JP 19831287 A JP19831287 A JP 19831287A JP 19831287 A JP19831287 A JP 19831287A JP S6444264 A JPS6444264 A JP S6444264A
Authority
JP
Japan
Prior art keywords
hole
org
solvent
solder
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19831287A
Other languages
Japanese (ja)
Inventor
Hiroo Shirahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19831287A priority Critical patent/JPS6444264A/en
Publication of JPS6444264A publication Critical patent/JPS6444264A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve the workability in soldering by providing a nozzle feeding a pressurized air and opening it in opposition to the through hole for an electronic part of one part of the above of a printed circuit board as well. CONSTITUTION:The frame 12 holding a printed circuit board 3 freely detachably at both ends is provided and a nozzle 13 is arranged as well freely liftably to the upper part of the board 3. The electronic part 4 washable by an org. solvent is inserted into a through hole 5 and when the board 3 removing the oxidized film is carried in, the frame 12 is dipped in a solder 2. The nozzle 13 is then descended and a pressurized air is injected from a tip part 13b to blow off the solder 2 flowed in the through hole 6 of the electronic part unwashable by the org. solvent. The solder clogging of the through hole 6 is thus prevented and the soldering work of the part unwashable by the org. solvent is facilitated and simplified. Consequently the soldering workability is improved.
JP19831287A 1987-08-10 1987-08-10 Soldering device Pending JPS6444264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19831287A JPS6444264A (en) 1987-08-10 1987-08-10 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19831287A JPS6444264A (en) 1987-08-10 1987-08-10 Soldering device

Publications (1)

Publication Number Publication Date
JPS6444264A true JPS6444264A (en) 1989-02-16

Family

ID=16389032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19831287A Pending JPS6444264A (en) 1987-08-10 1987-08-10 Soldering device

Country Status (1)

Country Link
JP (1) JPS6444264A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298463A (en) * 1991-08-30 1994-03-29 Micron Technology, Inc. Method of processing a semiconductor wafer using a contact etch stop
CN111702282A (en) * 2020-07-13 2020-09-25 迈普通信技术股份有限公司 Through hole element unsoldering device, system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298463A (en) * 1991-08-30 1994-03-29 Micron Technology, Inc. Method of processing a semiconductor wafer using a contact etch stop
CN111702282A (en) * 2020-07-13 2020-09-25 迈普通信技术股份有限公司 Through hole element unsoldering device, system and method

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