JPS57192059A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57192059A
JPS57192059A JP7658281A JP7658281A JPS57192059A JP S57192059 A JPS57192059 A JP S57192059A JP 7658281 A JP7658281 A JP 7658281A JP 7658281 A JP7658281 A JP 7658281A JP S57192059 A JPS57192059 A JP S57192059A
Authority
JP
Japan
Prior art keywords
lead
package
automatically
leads
parts feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7658281A
Other languages
Japanese (ja)
Other versions
JPH0116014B2 (en
Inventor
Fumihito Inoue
Kazuo Shimizu
Kazumasa Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7658281A priority Critical patent/JPS57192059A/en
Publication of JPS57192059A publication Critical patent/JPS57192059A/en
Publication of JPH0116014B2 publication Critical patent/JPH0116014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make it possible to align the direction by a parts feeder automatically and to supply the semiconductor devices automatically by arranging leads irregularly. CONSTITUTION:Every 5 leads 3 are protruded from the front and rear sides of a package 2 at an equal pitch (a). The second lead at the rear surface is cut short in the vicinity of the outer surface of the package 2 so as to form a dummy lead 6, whose tip does not contact with insertion holes and a land of a printed board. The third lead at the front surface of the package 2 is also the dummy lead. Since the lead arrangement is asymmetrical and irregular, the direction is automatically aligned by the parts feeder, and the devices can be supplied to various equipment.
JP7658281A 1981-05-22 1981-05-22 Semiconductor device Granted JPS57192059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7658281A JPS57192059A (en) 1981-05-22 1981-05-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7658281A JPS57192059A (en) 1981-05-22 1981-05-22 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57192059A true JPS57192059A (en) 1982-11-26
JPH0116014B2 JPH0116014B2 (en) 1989-03-22

Family

ID=13609269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7658281A Granted JPS57192059A (en) 1981-05-22 1981-05-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57192059A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593244A (en) * 1979-01-04 1980-07-15 Nec Corp Lead frame for semiconductor device
JPS5634346U (en) * 1979-08-24 1981-04-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2155338C2 (en) * 1971-11-08 1983-11-10 Degussa Ag, 6000 Frankfurt Use of a supported catalyst containing the elements Ni, Co and / or Fe as well as Ru, Ti and / or Mn and optionally La, Sr and / or Ba in oxidic form for the oxidation of combustible constituents of gas mixtures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593244A (en) * 1979-01-04 1980-07-15 Nec Corp Lead frame for semiconductor device
JPS5634346U (en) * 1979-08-24 1981-04-03

Also Published As

Publication number Publication date
JPH0116014B2 (en) 1989-03-22

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