JPS6425425A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS6425425A
JPS6425425A JP62182747A JP18274787A JPS6425425A JP S6425425 A JPS6425425 A JP S6425425A JP 62182747 A JP62182747 A JP 62182747A JP 18274787 A JP18274787 A JP 18274787A JP S6425425 A JPS6425425 A JP S6425425A
Authority
JP
Japan
Prior art keywords
paste
pellet
land
integrated circuit
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62182747A
Other languages
Japanese (ja)
Inventor
Eiji Nishiaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62182747A priority Critical patent/JPS6425425A/en
Publication of JPS6425425A publication Critical patent/JPS6425425A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To prevent paste for placing an IC pellet from extending by providing a protruding part having a predetermined width in directions of two diagonal lines on an IC pellet land. CONSTITUTION:Rear face wirings 3 are wired in a cross state as shown on an IC pellet land 1, and raised in shape. When paste 9 is supplied to the land 1, even if a collet of square shape is used, the paste is adhered in the cross shape. Accordingly, the paste is sufficiently supplied to the corners of an IC pellet 8, thereby eliminating the extension of the paste from the land 1. Since the paste is adhered from the center of the pellet 8, it has an effect of preventing air bubbles from remaining.
JP62182747A 1987-07-21 1987-07-21 Hybrid integrated circuit device Pending JPS6425425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62182747A JPS6425425A (en) 1987-07-21 1987-07-21 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62182747A JPS6425425A (en) 1987-07-21 1987-07-21 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6425425A true JPS6425425A (en) 1989-01-27

Family

ID=16123730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62182747A Pending JPS6425425A (en) 1987-07-21 1987-07-21 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6425425A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120993A (en) * 2004-10-25 2006-05-11 Toppan Forms Co Ltd Ic chip, and sheet with ic chip mounted thereon

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120993A (en) * 2004-10-25 2006-05-11 Toppan Forms Co Ltd Ic chip, and sheet with ic chip mounted thereon

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