JPS53107272A - Film substrate for semiconductor device - Google Patents

Film substrate for semiconductor device

Info

Publication number
JPS53107272A
JPS53107272A JP2241577A JP2241577A JPS53107272A JP S53107272 A JPS53107272 A JP S53107272A JP 2241577 A JP2241577 A JP 2241577A JP 2241577 A JP2241577 A JP 2241577A JP S53107272 A JPS53107272 A JP S53107272A
Authority
JP
Japan
Prior art keywords
semiconductor device
film substrate
simgle
achieve
increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2241577A
Other languages
Japanese (ja)
Inventor
Kazunari Michii
Takashi Kondo
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2241577A priority Critical patent/JPS53107272A/en
Publication of JPS53107272A publication Critical patent/JPS53107272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make possible feeding of simgle line film substrates and achieve the increase in wiring density by providing feed holes between the mounting holes disposed at a specified spacing on an organic insulation film.
COPYRIGHT: (C)1978,JPO&Japio
JP2241577A 1977-03-01 1977-03-01 Film substrate for semiconductor device Pending JPS53107272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2241577A JPS53107272A (en) 1977-03-01 1977-03-01 Film substrate for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2241577A JPS53107272A (en) 1977-03-01 1977-03-01 Film substrate for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53107272A true JPS53107272A (en) 1978-09-19

Family

ID=12082021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2241577A Pending JPS53107272A (en) 1977-03-01 1977-03-01 Film substrate for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53107272A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5788754A (en) * 1980-11-22 1982-06-02 Seiko Epson Corp Preparation of circuit substrate for timepiece
JPH01256137A (en) * 1988-04-06 1989-10-12 Casio Comput Co Ltd Carrier tape and its using method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5788754A (en) * 1980-11-22 1982-06-02 Seiko Epson Corp Preparation of circuit substrate for timepiece
JPS6366054B2 (en) * 1980-11-22 1988-12-19 Seiko Epson Corp
JPH01256137A (en) * 1988-04-06 1989-10-12 Casio Comput Co Ltd Carrier tape and its using method

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